C8051F321-GM Silicon Laboratories Inc, C8051F321-GM Datasheet - Page 147

IC 8051 MCU 16K FLASH 28MLP

C8051F321-GM

Manufacturer Part Number
C8051F321-GM
Description
IC 8051 MCU 16K FLASH 28MLP
Manufacturer
Silicon Laboratories Inc
Series
C8051F32xr
Datasheets

Specifications of C8051F321-GM

Program Memory Type
FLASH
Program Memory Size
16KB (16K x 8)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
21
Ram Size
2.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
2.25 KB
Interface Type
I2C/SMBus/SPI/UART/USB
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
21
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F320DK
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit or 17-ch x 10-bit
No. Of I/o's
21
Ram Memory Size
1280Byte
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1480 - DAUGHTER CARD TOOLSTCK C8051F321770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1449 - ADAPTER PROGRAM TOOLSTICK F321336-1260 - DEV KIT FOR C8051F320/F321
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1261

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15.5. FIFO Management
1024 bytes of on-chip XRAM are used as FIFO space for USB0. This FIFO space is split between
Endpoints0-3 as shown in Figure 15.3. FIFO space allocated for Endpoints1-3 is configurable as IN, OUT,
or both (Split Mode: half IN, half OUT).
15.5.1. FIFO Split Mode
The FIFO space for Endpoints1-3 can be split such that the upper half of the FIFO space is used by the IN
endpoint, and the lower half is used by the OUT endpoint. For example: if the Endpoint3 FIFO is configured
for Split Mode, the upper 256 bytes (0x0540 to 0x063F) are used by Endpoint3 IN and the lower 256 bytes
(0x0440 to 0x053F) are used by Endpoint3 OUT.
If an endpoint FIFO is not configured for Split Mode, that endpoint IN/OUT pair’s FIFOs are combined to
form a single IN or OUT FIFO. In this case only one direction of the endpoint IN/OUT pair may be used at
a time. The endpoint direction (IN/OUT) is determined by the DIRSEL bit in the corresponding endpoint’s
EINCSRH register (see Figure 15.20).
0x07C0
0x07BF
0x07FF
0x073F
0x063F
0x043F
0x03FF
0x0740
0x0640
0x0440
0x0400
0x0000
(1024 bytes)
User XRAM
(128 bytes)
(256 bytes)
(512 bytes)
Figure 15.3. USB FIFO Allocation
Endpoint0
Endpoint1
Endpoint2
Endpoint3
(64 bytes)
(64 bytes)
Free
Rev. 1.4
USB Clock Domain
System Clock Domain
IN, OUT, or both (Split
Configurable as
Mode)
C8051F320/1
147

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