C8051T614-GQ Silicon Laboratories Inc, C8051T614-GQ Datasheet - Page 30

• Manufacturer Part Number: C8051T614-GQ
• Description: IC 8051 MCU 8K BYTE-PROG 32-LQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051T61xr

Specifications of C8051T614-GQ

• Program Memory Type: OTP
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 32-LQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 29
• Ram Size: 1.25K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051T6x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 1.25 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 29
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051FT610DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 21-ch x 10-bit
• Package: 32LQFP
• Device Core: 8051
• Family Name: C8051T61x
• Maximum Speed: 25 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1441

C8051T610/1/2/3/4/5/6/7
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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10mm x 1.10mm openings on a 1.30mm pitch should be used for the center
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
pad.
Small Body Components.
Figure 6.2. QFN-24 Recommended PCB Land Pattern
Table 6.2. QFN-24 PCB Land Pattern Dimesions
3.90
3.90
0.20
Min
0.50 BSC
Max
4.00
4.00
0.30
Rev 1.0
Dimension
X2
Y1
Y2
2.70
0.65
2.70
Min
Max
2.80
0.75
2.80