LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 693
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
UM10237_4
User manual
10.2 Copy RAM to Flash
Table 621. IAP Prepare sector(s) for write operation command
Table 622. IAP Copy RAM to Flash command
Command
Input
Return Code
Result
Description
Command
Input
Return Code
Result
Description
Prepare sector(s) for write operation
Command code: 50
Param0: Start Sector Number
Param1: End Sector Number (should be greater than or equal to start sector
number).
CMD_SUCCESS |
BUSY |
INVALID_SECTOR
None
This command must be executed before executing "Copy RAM to Flash" or
"Erase Sector(s)" command. Successful execution of the "Copy RAM to Flash" or
"Erase Sector(s)" command causes relevant sectors to be protected again. The
boot sector can not be prepared by this command. To prepare a single sector use
the same "Start" and "End" sector numbers.
Copy RAM to Flash
Command code: 51
Param0(DST): Destination Flash address where data bytes are to be written. This
address should be a 256 byte boundary.
Param1(SRC): Source RAM address from which data bytes are to be read. This
address should be a word boundary.
Param2: Number of bytes to be written. Should be 256 | 512 | 1024 | 4096.
Param3: System Clock Frequency (CCLK) in kHz.
CMD_SUCCESS |
SRC_ADDR_ERROR (Address not a word boundary) |
DST_ADDR_ERROR (Address not on correct boundary) |
SRC_ADDR_NOT_MAPPED |
DST_ADDR_NOT_MAPPED |
COUNT_ERROR (Byte count is not 256 | 512 | 1024 | 4096) |
SECTOR_NOT_PREPARED_FOR_WRITE_OPERATION |
BUSY |
None
This command is used to program the Flash memory. The affected sectors should
be prepared first by calling "Prepare Sector for Write Operation" command. The
affected sectors are automatically protected again once the copy command is
successfully executed. The boot sector can not be written by this command.
Rev. 04 — 26 August 2009
Chapter 30: LPC24XX Flash memory programming firmware
10
10
UM10237
© NXP B.V. 2009. All rights reserved.
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