LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 61
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
UM10237_4
User manual
3.4.3 Power-down mode
3.4.4 Deep power-down mode
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Sleep mode and the logic levels of chip pins remain static. The
Sleep mode can be terminated and normal operation resumed by either a Reset or certain
specific interrupts that are able to function without clocks. Since all dynamic operation of
the chip is suspended, Sleep mode reduces chip power consumption to a very low value.
On the wakeup of sleep mode, if the IRC was used before entering sleep mode, the 2-bit
IRC timer starts counting and the code execution and peripherals activities will resume
after the timer expires (4 cycles). If the main external oscillator was used, the 12-bit main
oscillator timer starts counting and the code execution will resume when the timer expires
(4096 cycles). Customer must not forget to re-configure the PLL and clock dividers after
the wakeup.
Power-down mode does everything that Sleep mode does, but also turns off the flash
memory. This saves more power, but requires waiting for resumption of flash operation
before execution of code or data access in the flash memory can be accomplished.
When the chip enters power-down mode, the IRC, the main oscillator and all clocks are
stopped. The 32Khz RTC oscillator is not stopped because the RTC interrupts may be
used as the wakeup source. The flash is forced into power-down mode. The PLL is
automatically turned off and disconnected. The CCLK and USBCLK clock dividers
automatically get reset to zero.
On the wakeup of power-down mode, if the IRC was used before entering power-down
mode, after IRC-start-up time (60 μs), the 2-bit IRC timer starts counting and expires in 4
cycles. The code execution can then be resumed immediately upon the expiration of the
IRC timer if the code was running from SRAM. In the meantime, the flash wakeup-timer
generates flash start-up time 100 μs. When it times out, access to the flash is enabled.
Customer must not forget to re-configure the PLL and clock dividers after the wakeup.
Deep power-down mode is like Power-down mode, but the on-chip regulator that supplies
power to internal logic is also shut off. This produces the lowest possible power
consumption without actually removing power from the entire chip. Since Deep
power-down mode shuts down the on-chip logic power supply, there is no register or
memory retention, and resumption of operation involves the same activities as a full-chip
reset.
If power is supplied to the LPC2400 during Deep power-down mode, wakeup can be
caused by the RTC alarm or external reset.
While in Deep power-down mode, external device power may be removed. In this case,
the LPC2400 will start up when external power is restored.
Essential data may be retained through Deep power-down mode (or through complete
powering off of the chip) by storing data in the battery RAM, as long as the external power
to the VBAT pin is maintained.
Rev. 04 — 26 August 2009
Chapter 4: LPC24XX Clocking and power control
UM10237
© NXP B.V. 2009. All rights reserved.
61 of 792
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