DSPIC30F6012A-30I/PF Microchip Technology, DSPIC30F6012A-30I/PF Datasheet - Page 178

• Manufacturer Part Number: DSPIC30F6012A-30I/PF
• Description: IC DSPIC MCU/DSP 144K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6012A-30I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 52
• Flash Memory Size: 144KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 52
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

dsPIC30F6011A/6012A/6013A/6014A
TABLE 23-2:
TABLE 23-3:
TABLE 23-4:
DS70143D-page 178
dsPIC30F601xA-30I
dsPIC30F601xA-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
V
V
V
V
S
P
Symbol
INT
Junction to ambient thermal resistance, Theta-ja (
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
DD
DR
POR
VDD
I
/
O
=
=
∑
V
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DD
(
{
(2)
V
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
×
D D
DD
DD
(
I
DD
–
Start Voltage
Rise Rate
Characteristic
V
–
OH
∑
Rating
Characteristic
} I
I
OH
×
)
OH
)
DD
+
∑
can be lowered without losing RAM data.
(
V
O L
×
I
OL
(3)
)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
1.75
0.05
Min
2.5
3.0
—
θ
JA
) numbers are achieved by package simulations.
Typ
—
—
—
—
—
Symbol
Symbol
P
(1)
DMAX
θ
θ
θ
θ
P
T
T
T
T
A
A
JA
JA
JA
JA
D
J
J
Max
V
5.5
5.5
—
—
SS
Min
Typ
-40
-40
-40
-40
34
34
39
39
-40°C ≤ T
-40°C ≤ T
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
© 2008 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3V in 60 ms
- T
Max
Typ
A
A
—
—
—
—
—
—
—
—
+ P
A
≤ +85°C for Industrial
≤ +125°C for Extended
)/
θ
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1