PIC16F72-I/SP Microchip Technology, PIC16F72-I/SP Datasheet - Page 392

IC PIC MCU FLASH 2KX14 28DIP

PIC16F72-I/SP

Manufacturer Part Number
PIC16F72-I/SP
Description
IC PIC MCU FLASH 2KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F72-I/SP

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 5 Channel
Data Rom Size
8 B
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PICmicro MID-RANGE MCU FAMILY
21.5
DS31021A-page 21-8
2T
8T
32T
RC
Legend: Shaded cells are outside of recommended range.
Note 1: The RC source has a typical T
2T
8T
32T
RC
Legend: Shaded cells are outside of recommended range.
Note 1: The RC source has a typical T
OSC
OSC
OSC
OSC
Operation
Operation
OSC
OSC
2: These values violate the minimum required T
3: For faster conversion times, the selection of another clock source is recommended.
4: For device frequencies above 1 MHz, the device must be in SLEEP for the entire conversion, or the A/D
2: These values violate the minimum required T
3: For faster conversion times, the selection of another clock source is recommended.
4: For device frequencies above 1 MHz, the device must be in SLEEP for the entire conversion, or the A/D
AD Clock Source (T
AD Clock Source (T
accuracy may be out of specification.
accuracy may be out of specification.
Selecting the A/D Conversion Clock
ADCS1:ADCS0
ADCS1:ADCS0
The A/D conversion time per bit is defined as T
conversion. The source of the A/D conversion clock is software selected. The four possible
options for T
For correct A/D conversions, the A/D conversion clock (T
mum T
ifications.
Table 21-1
quencies and the A/D clock source selected.
Table 21-1: T
Table 21-2: T
• 2T
• 8T
• 32T
• Internal RC oscillator
00
01
10
11
00
01
10
11
AD
AD
AD
)
)
OSC
OSC
time of 1.6 s for all devices, as shown in
OSC
and
AD
AD
AD
are:
Table 21-2
100 ns
400 ns
1.6 s
2 - 6 s
500 ns
2.0 s
8.0 s
3 - 9 s
AD
AD
vs. Device Operating Frequencies (for Standard, C, Devices)
vs. Device Operating Frequencies (for Extended, LC, Devices)
time of 4 s.
time of 6 s.
20 MHz
4 MHz
(2)
(2)
(2)
(2)
(1,4)
(1,4)
show the resultant T
AD
AD
time.
time.
400 ns
1.6 s
6.4 s
2 - 6 s
1.0 s
4.0 s
16.0 s
3 - 9 s
5 MHz
2 MHz
(2)
(2)
(1,4)
(1,4)
Device Frequency
Device Frequency
AD
AD
. The A/D conversion requires 9.5 T
parameter 130
times derived from the device operating fre-
1.6 s
6.4 s
25.6 s
2 - 6 s
1.6 s
6.4 s
25.6 s
3 - 9 s
AD
) must be selected to ensure a mini-
1.25 MHz
1.25 MHz
(2)
(3)
(3)
(1,4)
(1,4)
of the devices electrical spec-
1997 Microchip Technology Inc.
6 s
24 s
96 s
2 - 6 s
6 s
24 s
96 s
3 - 9 s
333.33 kHz
333.33 kHz
(3)
(3)
(3)
(3)
AD
(1)
(1)
per 8-bit

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