PIC16F72-I/SP Microchip Technology, PIC16F72-I/SP Datasheet - Page 277

• Manufacturer Part Number: PIC16F72-I/SP
• Description: IC PIC MCU FLASH 2KX14 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F72-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 5 Channel
• Data Rom Size: 8 B
• Height: 3.3 mm
• Length: 34.67 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

I
M
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C is a trademark of Philips Corporation.
1997 Microchip Technology Inc.
Section 17. Master Synchronous Serial Port (MSSP)
HIGHLIGHTS
This section of the manual contains the following major topics:
17.1 Introduction ..................................................................................................................17-2
17.2 Control Register ...........................................................................................................17-4
17.3 SPI Mode .....................................................................................................................17-9
17.4 SSP I
17.5 Connection Considerations for I
17.6 Initialization ................................................................................................................17-57
17.7 Design Tips ................................................................................................................17-58
17.8 Related Application Notes..........................................................................................17-59
17.9 Revision History .........................................................................................................17-60
Note:
At present NO Mid-Range MCU devices are available with this module. Devices are
planned, but there is no schedule for availability. Please refer to Microchip’s Web site
or BBS for release of Product Briefs. You will be able to find out the details and the
features for new devices.
This module is available on Microchip’s High End family (PIC17CXXX). Please
refer to Microchip’s Web site, BBS, Regional Sales Office, or Factory Repre-
sentatives.
2
C™ Operation .................................................................................................17-18
Preliminary
2
C Bus .....................................................................17-56
DS31017A page 17-1
17