PIC12C509A-04/SM Microchip Technology, PIC12C509A-04/SM Datasheet - Page 99

• Manufacturer Part Number: PIC12C509A-04/SM
• Description: IC MCU OTP 1KX12 8-SOIJ
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C509A-04/SM

• Core Size: 8-Bit
• Program Memory Size: 1.5KB (1K x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: OTP
• Ram Size: 41 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 41Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: SOIC
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 41 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 8
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: DVMCPA, ICE2000
• Minimum Operating Temperature: 0 C
• Package: 8SOIJ
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 4 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT08SO-1 - SOCKET TRANSITION 8SOIC 150/208AC164312 - MODULE SKT FOR PM3 16SOICISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

15.0
15.1
1999 Microchip Technology Inc.
*
PACKAGING INFORMATION
Package Marking Information
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
8-Lead PDIP (300 mil)
8-Lead SOIC (150 mil)
8-Lead SOIC (208 mil)
8-Lead Windowed Ceramic Side Brazed (300 mil)
Legend: MM...M
Note:
XXXXXX
XXXXXXX
XXXXXXX
XXXXXXX
AABBCDE
XXXXXXXX
XXXXXCDE
AABB
XXX
AABB
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Example
Example
Example
Example
12C508A
12C508A
04I/SM
C508A
9824SAZ
12C508A
04I/PSAZ
9825
JW
9825
PIC12C5XX
DS40139E-page 99