PIC12C509A-04/SM Microchip Technology, PIC12C509A-04/SM Datasheet - Page 100

• Manufacturer Part Number: PIC12C509A-04/SM
• Description: IC MCU OTP 1KX12 8-SOIJ
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C509A-04/SM

• Core Size: 8-Bit
• Program Memory Size: 1.5KB (1K x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: OTP
• Ram Size: 41 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 41Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: SOIC
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 41 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 8
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: DVMCPA, ICE2000
• Minimum Operating Temperature: 0 C
• Package: 8SOIJ
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 4 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT08SO-1 - SOCKET TRANSITION 8SOIC 150/208AC164312 - MODULE SKT FOR PM3 16SOICISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC12C5XX
Package Type:
DS40139E-page 100
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
†
‡
* Controlling Parameter.
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
eB
E1
E
R
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
‡
‡
†
2
1
c
D
MIN
0.014
0.055
0.000
0.006
0.140
0.060
0.005
0.120
0.355
0.245
0.267
0.310
5
5
A
A2
INCHES*
NOM
0.300
0.100
0.018
0.060
0.005
0.012
0.150
0.080
0.020
0.130
0.370
0.250
0.280
0.342
B1
B
10
10
8
MAX
0.022
0.065
0.010
0.015
0.160
0.100
0.035
0.140
0.385
0.260
0.292
0.380
15
15
MIN
0.36
1.40
0.00
0.20
3.56
1.52
0.13
3.05
9.02
6.22
6.78
7.87
MILLIMETERS
5
5
1999 Microchip Technology Inc.
NOM
p
7.62
2.54
0.46
1.52
0.13
0.29
3.81
2.03
0.51
3.30
9.40
6.35
7.10
8.67
A1
10
10
8
L
MAX
0.56
1.65
0.25
0.38
4.06
2.54
0.89
3.56
9.78
6.60
7.42
9.65
15
15