lh28f016sc-l Sharp Microelectronics of the Americas, lh28f016sc-l Datasheet

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lh28f016sc-l

Manufacturer Part Number
lh28f016sc-l
Description
M-bit Smartvoltage Flash Memories
Manufacturer
Sharp Microelectronics of the Americas
Datasheet
DESCRIPTION
The LH28F016SC-L/SCH-L flash memories with
SmartVoltage technology are high-density, low-cost,
nonvolatile, read/write storage solution for a wide
range of applications. Their symmetrically-blocked
architecture, flexible voltage and enhanced cycling
capability provide for highly flexible component
suitable for resident flash arrays, SIMMs and
memory
capabilities provide for an ideal solution for code +
data storage applications. For secure code storage
applications, such as networking, where code is
either directly executed out of flash or downloaded
to DRAM, the LH28F016SC-L/SCH-L offer three
levels of protection : absolute protection with Vpp at
GND, selective hardware block locking, or flexible
software block locking. These alternatives give
designers ultimate control of their code security
needs.
FEATURES
• SmartVoltage technology
• High performance read access time
COMPARISON TABLE
LH28F016SC-L/SCH-L
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books,
etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LH28F016SC-L
LH28F016SCH-L
– 2.7 V (Read-only), 3.3 V or 5 V V
– 3.3 V, 5 V or 12 V V
LH28F016SC-L95/SCH-L95
– 95 ns (5.0±0.25 V)/100 ns (5.0±0.5 V)/
LH28F016SC-L12/SCH-L12
– 120 ns (5.0±0.5 V)/150 ns (3.3±0.3 V)/
VERSIONS
120 ns (3.3±0.3 V)/150 ns (2.7 to 3.6 V)
170 ns (2.7 to 3.6 V)
cards.
Their
TEMPERATURE
OPERATING
–40 to +85˚C
0 to +70˚C
PP
enhanced
CC
V
suspend
CC
deep power-down current (MAX.)
DC CHARACTERISTICS
- 1 -
10 µA
20 µA
• Enhanced automated suspend options
• Enhanced data protection features
• SRAM-compatible write interface
• High-density symmetrically-blocked architecture
• Enhanced cycling capability
• Low power management
• Automated byte write and block erase
• ETOX
• Packages
ETOX is a trademark of Intel Corporation.
– Byte write suspend to read
– Block erase suspend to byte write
– Block erase suspend to read
– Absolute protection with V
– Flexible block locking
– Block erase/byte write lockout during power
– Thirty-two 64 k-byte erasable blocks
– 100 000 block erase cycles
– 3.2 million block erase cycles/chip
– Deep power-down mode
– Automatic power saving mode decreases I
– Command user interface
– Status register
– 40-pin TSOP Type I (TSOP040-P-1020)
– 44-pin SOP (SOP044-P-0600)
– 48-ball CSP (FBGA048-P-0810)
16 M-bit (2 MB x 8) SmartVoltage
transitions
in static mode
TM
V nonvolatile flash technology
40-pin TSOP (I), 44-pin SOP,
48-ball CSP
40-pin TSOP (I), 48-ball CSP
Normal bend/Reverse bend
LH28F016SC-L/SCH-L
PACKAGE
Flash Memories
[LH28F016SC-L]
PP
= GND
CC

Related parts for lh28f016sc-l

lh28f016sc-l Summary of contents

Page 1

... For secure code storage applications, such as networking, where code is either directly executed out of flash or downloaded to DRAM, the LH28F016SC-L/SCH-L offer three levels of protection : absolute protection with Vpp at GND, selective hardware block locking, or flexible software block locking. These alternatives give designers ultimate control of their code security needs ...

Page 2

... (TSOP040-P-1020) NOTE : Reverse bend available on request. 48-BALL CSP 44-PIN SOP [LH28F016SC RY/BY ...

Page 3

... BUFFER ADDRESS LATCH X DECODER ADDRESS COUNTER DQ - OUTPUT INPUT BUFFER BUFFER IDENTIFIER REGISTER STATUS REGISTER DATA COMPARATOR Y GATING 32 64 k-BYTE BLOCKS - 3 - LH28F016SC-L/SCH-L I LOGIC CE# WE# COMMAND USER INTERFACE OE# RP# RY/BY# WRITE V STATE PP PROGRAM/ERASE MACHINE VOLTAGE SWITCH V CC GND ...

Page 4

... HH < RP# < V produce spurious results and should not be attempted. HH (see Section 6.2.3 "DC CHARACTERISTICS") produce spurious results PP to the new voltage. Do not float any power pins. With LH28F016SC-L/SCH-L enables setting of the HH ≤ memory PP PPLK down to GND and then CC ≤ V ...

Page 5

... To take advantage of SmartVoltage technology, allow V connection to 3 1.2 Product Overview The LH28F016SC-L/SCH-L are high-performance 16 M-bit SmartVoltage flash memories organized as 2 M-byte of 8 bits. The 2 M-byte of data is arranged in thirty-two 64 k-byte blocks which are individually erasable, lockable, and unlockable in- system ...

Page 6

... The access time voltage range of 4.75 to 5.25 V over the temperature range +70°C (LH28F016SC-L)/ –40 to +85°C (LH28F016SCH-L). At 4 the access time is 100 ns or 120 ns. At lower CC ...

Page 7

... Block 010000 00FFFF 64 k-Byte Block 000000 Fig. 1 Memory Map 2 PRINCIPLES OF OPERATION The LH28F016SC-L/SCH-L SmartVoltage flash 31 memories include an on-chip WSM to manage 30 block erase, byte write, and lock-bit configuration 29 functions. It allows for : 100% TTL-level control 28 inputs, fixed power supplies during block erasure, ...

Page 8

... During block erase, byte write, or lock-bit configuration modes, RP#-low will abort the operation. RY/BY# remains low until the reset operation is complete. Memory contents being altered are no longer valid; the data may LH28F016SC-L/SCH-L ) control and when active drives the and RP# must Fig ...

Page 9

... Fig. 2 Device Identifier Code Memory Map - 9 - LH28F016SC-L/SCH-L Reserved for Future Implementation Block 31 Lock Configuration Code Reserved for Future Implementation Block 31 (Blocks 2 through 30) Reserved for Future Implementation Block 1 Lock Configuration Code Reserved for ...

Page 10

... V V PPH1/2/3 lock-bit configuration with V voltages. V produce spurious results and should not be PPH1/2/3 HH attempted. 7. Refer to Table 3 for valid D 8. Don't use the timing both OE# and WE# are LH28F016SC-L/SCH-L voltage ≤ read operations PP PPLK on V enables PPH1/2/3 PP ADDRESS V DQ RY/BY# ...

Page 11

... Clear Block Lock-Bits command can be done while RP Commands other than those shown above are reserved by SHARP for future device implementations and should not be used. to enable LH28F016SC-L/SCH-L (NOTE 9) SECOND BUS CYCLE (NOTE 3) (NOTE 1) (NOTE 2) Data Oper ...

Page 12

... FFH). Block preconditioning, erase, and verify are handled internally by the WSM (invisible to the system). After the two-cycle block erase sequence is written LH28F016SC-L/SCH-L voltage. RP voltage. RP# can PP ...

Page 13

... At this point, a Read Array command can be written to read data from blocks other than that which is suspended. A Byte Write command sequence can also be issued during erase suspend to program data in other blocks. Using the Byte - 13 - LH28F016SC-L/SCH the absence of this PP PPH1/2/3 , status register bits SR.3 and SR.4 will ...

Page 14

... Fig. 7). The CPU can detect the completion of the set lock- bit event by analyzing the RY/BY# pin output or status register bit SR. LH28F016SC-L/SCH-L must remain at PP (the same V level used for byte write) PP ...

Page 15

... active transition, block lock-bit values are left in an undetermined state. A repeat of clear block lock-bits is required to initialize block lock-bit contents to known values. Once the master lock-bit is set, it cannot be cleared LH28F016SC-L/SCH-L and clear block PP PPH1/2/3 ≤ PPLK ...

Page 16

... Reading the block lock and master lock configuration codes after writing the Read Identifier Codes command indicates master and block lock-bit status. SR.0 is reserved for future use and should be masked out when polling the status register LH28F016SC-L/SCH-L EFFECT BWSS DPS " ...

Page 17

... Command Sequence SR. Error 0 1 Block Erase SR.5 = Error 0 Block Erase Successful Fig. 3 Automated Block Erase Flowchart LH28F016SC-L/SCH-L BUS COMMAND COMMENTS OPERATION Data = 20H Write Erase Setup Addr = Within Block to be Erased Erase Data = D0H Write Confirm Addr = Within Block to be Erased ...

Page 18

... SR.1 = Device Protect Error 0 1 SR.4 = Byte Write Error 0 Byte Write Successful Fig. 4 Automated Byte Write Flowchart LH28F016SC-L/SCH-L BUS COMMAND COMMENTS OPERATION Setup Data = 40H Write Byte Write Addr = Location to be Written Data = Data to be Written Write Byte Write Addr = Location to be Written ...

Page 19

... Fig. 5 Block Erase Suspend/Resume Flowchart BUS COMMAND OPERATION Erase Write Suspend Read Standby Standby Erase Write Resume Read - 19 - LH28F016SC-L/SCH-L COMMENTS Data = B0H Addr = X Status Register Data Addr = X Check SR WSM Ready 0 = WSM Busy Check SR Block Erase Suspended 0 = Block Erase Completed Data = D0H Addr = X ...

Page 20

... Write FFH Read Array Data No Done Reading Yes Write D0H Write FFH Read Byte Write Resumed Array Data Fig. 6 Byte Write Suspend/Resume Flowchart LH28F016SC-L/SCH-L BUS COMMAND COMMENTS OPERATION Byte Write Data = B0H Write Suspend Addr = X Status Register Data Read Addr = X Check SR ...

Page 21

... Both 1 = Command Sequence Error Check SR.4 Standby 1 = Set Lock-Bit Error SR.5, SR.4, SR.3 and SR.1 are only cleared by the Clear Status Register command in cases where multiple lock-bits are set before full status is checked. If error is detected, clear the status register before attempting retry or other error recovery LH28F016SC-L/SCH-L ...

Page 22

... Device Protect Error 0 1 Command Sequence SR. Error 0 1 Clear Block Lock-Bits SR.5 = Error 0 Clear Block Lock-Bits Successful Fig. 8 Clear Block Lock-Bits Flowchart LH28F016SC-L/SCH-L BUS COMMAND COMMENTS OPERATION Clear Block Data = 60H Write Lock-Bits Addr = X Setup Clear Block Data = D0H Write Lock-Bits ...

Page 23

... Then, the operation will abort and the device will enter deep power-down. The aborted operation may leave data partially altered. Therefore, the System command sequence must be repeated after normal - 23 - LH28F016SC-L/SCH power supply PP CC supply traces and ...

Page 24

... RP# is first raised to V 6.2.4 through 6.2.6 "AC CHARACTERISTICS - READ-ONLY and WRITE OPERATIONS" and Fig. 13, Fig. 14 and Fig. 15 for more information. when V is LKO PP will inhibit LH28F016SC-L/SCH-L standby or sleep modes and t wake-up cycles PHQV PHWL . See Section IH ...

Page 25

... ELECTRICAL SPECIFICATIONS 6.1 Absolute Maximum Ratings Operating Temperature • LH28F016SC-L During Read, Block Erase, Byte Write and Lock-Bit Configuration ........ 0 to +70°C Temperature under Bias ............. –10 to +80°C • LH28F016SCH-L During Read, Block Erase, Byte Write and Lock-Bit Configuration .... –40 to +85°C Temperature under Bias ............. –40 to +85°C Storage Temperature ........................ – ...

Page 26

... TEST POINTS = 5.0±0.25 V (High Speed Testing Configuration) CC 2.0 TEST POINTS 0.8 (2 for a Logic "1" and V OH TTL OL (0 Output timing ends at V TTL 5.0±0.5 V (Standard Testing Configuration LH28F016SC-L/SCH-L UNIT CONDITION 0 0.0 V OUT 1.35 OUTPUT = 2 1.5 OUTPUT = 3.3±0.3 V and CC 2 ...

Page 27

... UNDER TEST Includes Jig L Capacitance Fig. 12 Transient Equivalent Testing Load Circuit Test Configuration Capacitance Loading Value TEST CONFIGURATION V = 3.3±0.3 V, 2 (NOTE 5.0±0. 5.0±0 NOTE : 1. Applied to high-speed products, LH28F016SC-L95 and LH28F016SCH-L95. OUT - 27 - LH28F016SC-L/SCH-L C (pF 100 ...

Page 28

... LH28F016SC-L/SCH-L = 5.0±0.5 V TEST CC UNIT CONDITIONS Max ±1 µ GND Max ±10 µ GND OUT CC CMOS Inputs ...

Page 29

... V V and should not be attempted. HH (min.), between 9. RP# connection PPH1 (max.) maximum cumulative period of 80 hours. PPH2 (max.). to CCR LH28F016SC-L/SCH-L = 5.0±0.5 V TEST CC UNIT CONDITIONS MIN. MAX. – 0.5 0 2 Min ...

Page 30

... CE# without impact LH28F016SC-L/SCH-L (NOTE 1) LH28F016SC-L12 LH28F016SCH-L12 UNIT MAX. MIN. MAX. 170 150 170 150 170 600 600 LH28F016SC-L12 LH28F016SCH-L12 UNIT MAX. MIN. MAX. 150 120 150 120 150 600 600 ELQV ns ns ...

Page 31

... See Fig. 11 "Transient Input/Output Reference Waveform" and Fig. 12 "Transient Equivalent Testing after the falling Load Circuit" (Standard Configuration) for testing GLQV . characteristics LH28F016SC-L/SCH-L (NOTE 1) (NOTE 5) (NOTE 5) LH28F016SC-L95 LH28F016SC-L12 LH28F016SCH-L95 LH28F016SCH-L12 MIN. MAX. MIN. MAX. 100 120 100 120 100 120 ...

Page 32

... V IH WE# ( High Z DATA (D/Q) ( RP# ( Fig Waveform for Read Operations Device Data Valid Address Selection Address Stable t AVAV t ELQV t GLQV t GLQX t ELQX Valid Output t AVQV t PHQV - 32 - LH28F016SC-L/SCH-L t EHQZ t GHQZ t OH High Z ...

Page 33

... LH28F016SC-L/SCH-L LH28F016SC-L12 LH28F016SCH-L12 UNIT MAX. MIN. MAX. 170 ns 1 µ LH28F016SC-L12 LH28F016SCH-L12 UNIT MAX. MIN. MAX. 150 ns 1 µ 100 ns 100 100 ...

Page 34

... Load Circuit" (High Seed Configuration) for testing characteristics. 6. See Fig. 11 "Transient Input/Output Reference for block erase, Waveform" and Fig. 12 "Transient Equivalent Testing IN Load Circuit" (Standard Configuration) for testing characteristics LH28F016SC-L/SCH-L (NOTE 1) (NOTE 6) (NOTE 6) LH28F016SC-L95 LH28F016SC-L12 LH28F016SCH-L95 LH28F016SCH-L12 MIN. MAX. MIN. MAX. 100 120 ...

Page 35

... Write Read Array command. Fig Waveform for WE#-Controlled Write Operations (NOTE 3) (NOTE AVAV AVWH WHAX t WHEH t WHGL t t WHWL WHQV1/2/3/4 t WLWH t DVWH t WHDX WHRL t PHHWH t VPWH - 35 - LH28F016SC-L/SCH-L (NOTE 5) (NOTE 6) Valid D IN SRD t QVPH t QVVL ...

Page 36

... LH28F016SC-L/SCH-L LH28F016SC-L12 LH28F016SCH-L12 UNIT MIN. MAX. 170 ns 1 µ LH28F016SC-L12 LH28F016SCH-L12 UNIT MIN. MAX. 150 ns 1 µ 100 ns 100 100 ...

Page 37

... Load Circuit" (High Seed Configuration) for testing characteristics. 6. See Fig. 11 "Transient Input/Output Reference for block erase, Waveform" and Fig. 12 "Transient Equivalent Testing IN Load Circuit" (Standard Configuration) for testing characteristics LH28F016SC-L/SCH-L (NOTE 1) (NOTE 6) (NOTE 6) LH28F016SC-L95 LH28F016SC-L12 LH28F016SCH-L95 LH28F016SCH-L12 MIN. MAX. MIN. MAX. 100 120 ...

Page 38

... Read status register data. 6. Write Read Array command. Fig Waveform for CE#-Controlled Write Operations (NOTE 3) (NOTE AVEH EHAX t EHWH t EHGL t t EHEL EHQV1/2/3/4 t ELEH t DVEH t EHDX EHRL t PHHEH t VPEH - 38 - LH28F016SC-L/SCH-L (NOTE 5) (NOTE 6) Valid D IN SRD t QVPH t QVVL ...

Page 39

... A reset time RP# going high until outputs are valid. 4. When the device power-up, holding RP#-low minimum 100 ns is required after V range and also has been in stable there LH28F016SC-L/SCH 3.3±0 5.0±0 MIN. MAX. MIN. MAX. ...

Page 40

... C ˚ NOTE MIN. TYP. 2 6.5 2 0.4 2 0.9 2 9.5 2 0.9 3. These performance numbers are valid for all speed versions. 4. Sampled, not 100% tested LH28F016SC-L/SCH-L (NOTE 5.0±0 12.0±0 (NOTE 1) (NOTE 1) MAX. MIN. TYP. MAX. 9.3 TBD 6.7 7.6 TBD 0.5 TBD 0.4 0.5 TBD 1 ...

Page 41

... V), 100 ns (5.0 0.5 V), 120 ns (3.3 0.3 V), 150 ns (2 120 ns (5.0 0.5 V), 150 ns (3.3 0.3 V), 170 ns (2.7 to 3.6 V) Package T = 40-pin TSOP (I) (TSOP040-P-1020) Normal bend R = 40-pin TSOP (I) (TSOP040-P-1020) Reverse bend N = 44-pin SOP (SOP044-P-0600) [LH28F016SC- 48-ball CSP (FBGA048-P-0810) VALID OPERATIONAL COMBINATIONS = 2 3.3±0 ...

Page 42

TSOP (TSOP040-P-1020 0.3 20.0 0.2 18.4 0.3 19.0 PACKAGING Package base plane ...

Page 43

SOP (SOP044-P-0600 0.4 0 0.1 0.15 M 1.27 TYP 0.2 28.2 PACKAGING 0.15 0.05 Package base plane ...

Page 44

CSP (FBGA048-P-0810 0.1 S 3.0 0.8 0 0.1 S TYP. 0.4 + 0.2 10 TYP. TYP. TYP 0.03 0. PACKAGING Land ...

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