CY7C1380C-167AI Cypress Semiconductor Corp, CY7C1380C-167AI Datasheet - Page 6

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CY7C1380C-167AI

Manufacturer Part Number
CY7C1380C-167AI
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1380C-167AI

Density
18Mb
Access Time (max)
3.4ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
166MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
19b
Package Type
TQFP
Operating Temp Range
-40C to 85C
Number Of Ports
4
Supply Current
275mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.465V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
512K
Lead Free Status / Rohs Status
Not Compliant
Document #: 38-05237 Rev. *D
CY7C1380C–Pin Definitions
Name
A
BW
BW
GW
BWE
CLK
CE
CE
CE
OE
ADV
0
, A
1
2
3
A,
C,
[2]
[2]
1
BW
BW
, A
B
D
42,43,44,45,
82,99,100
37,36,32,
33,34,35,
46,47,48,
49,50,81,
93,94,95,
TQFP
96
88
87
89
98
97
92
86
83
T3,T4,A5,B5,
T5,A6,B6,C6,
A3,B3,C3,
P4,N4,
C2,R2,
A2,B2,
L5,G5,
G3,L3
BGA
C5,
M4
G4
R6
H4
K4
E4
F4
-
-
B10,N6,P3,P4,
P11,R3,R4,R8,
R9,R10,R11
P8,P9,P10,
R6,P6,A2,
B5,A5,A4,
A10,B2,
fBGA
B4
B7
A7
B6
A3
B3
A6
B8
A9
Asynchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Input-
Input-
Input-
Input-
Input-
Clock
Input-
Input-
Input-
Input-
Input-
I/O
Address Inputs used to select one of the
256K address locations. Sampled at the rising
edge of the CLK if ADSP or ADSC is active
LOW, and CE
active. A1: A0 are fed to the two-bit counter. .
Byte Write Select Inputs, active LOW.
Qualified with BWE to conduct byte writes to the
SRAM. Sampled on the rising edge of CLK.
Global Write Enable Input, active LOW.
When asserted LOW on the rising edge of CLK,
a global write is conducted (ALL bytes are
written, regardless of the values on BW
BWE).
Byte Write Enable Input, active LOW. Sam-
pled on the rising edge of CLK. This signal must
be asserted LOW to conduct a byte write.
Clock Input. Used to capture all synchronous
inputs to the device. Also used to increment the
burst counter when ADV is asserted LOW,
during a burst operation.
Chip Enable 1 Input, active LOW. Sampled on
the rising edge of CLK. Used in conjunction with
CE
ADSP is ignored if CE
Chip Enable 2 Input, active HIGH. Sampled
on the rising edge of CLK. Used in conjunction
with CE
Chip Enable 3 Input, active LOW. Sampled on
the rising edge of CLK. Used in conjunction with
CE
available for AJ package version. Not
connected for BGA. Where referenced, CE
assumed active throughout this document for
BGA.
Output Enable, asynchronous input, active
LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins behave as outputs.
When deasserted HIGH, I/O pins are tri-stated,
and act as input data pins. OE is masked during
the first clock of a read cycle when emerging
from a deselected state.
Advance Input signal, sampled on the rising
edge of CLK, active LOW. When asserted, it
automatically increments the address in a burst
cycle.
2
1
and CE
and CE
1
and CE
2
3
to select/deselect the device.Not
1
to select/deselect the device.
, CE
3
Description
to select/deselect the device.
2
, and CE
1
is HIGH.
CY7C1380C
CY7C1382C
3
[2]
are sampled
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