AD7792BRUZ Analog Devices Inc, AD7792BRUZ Datasheet - Page 27

• Manufacturer Part Number: AD7792BRUZ
• Description: IC ADC 16BIT SIG-DEL 3CH 16TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD7792BRUZ

• Data Interface: DSP, MICROWIRE™, QSPI™, Serial, SPI™
• Number Of Bits: 16
• Sampling Rate (per Second): 500
• Number Of Converters: 1
• Power Dissipation (max): 2.5mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Resolution (bits): 16bit
• Sampling Rate: 470SPS
• Input Channel Type: Differential
• Supply Voltage Range - Analog: 2.7V To 5.25V
• Supply Voltage Range - Digital: 2.7V To 5.25V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-AD7792EBZ - BOARD EVALUATION FOR AD7792
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

The ground planes of the AD7792/AD7793 should be allowed
to run under the AD7792/AD7793 to prevent noise coupling.
The power supply lines to the AD7792/AD7793 should use as
wide a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with digital
ground to avoid radiating noise to other sections of the board,
and clock signals should never be run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A microstrip technique is by far the best, but it is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to ground planes,
and signals are placed on the solder side.
Rev. B | Page 27 of 32
Good decoupling is important when using high resolution
ADCs. AV
parallel with 0.1 μF capacitors to GND. DV
decoupled with 10 μF tantalum in parallel with 0.1 μF
capacitors to the system’s DGND plane, with the system’s
AGND to DGND connection being close to the
AD7792/AD7793.
To achieve the best from these decoupling components, they
should be placed as close as possible to the device, ideally right
up against the device. All logic chips should be decoupled with
0.1 μF ceramic capacitors to DGND.
DD
should be decoupled with 10 μF tantalum in
AD7792/AD7793
DD
should be