CY7C65113-SXC Cypress Semiconductor Corp, CY7C65113-SXC Datasheet - Page 48

CY7C65113-SXC

Manufacturer Part Number
CY7C65113-SXC
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C65113-SXC

Operating Temperature (max)
70C
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Package Type
SOIC
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C65113-SXC
Manufacturer:
CYPRESS
Quantity:
770
Part Number:
CY7C65113-SXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
24.0
25.0
Purchase of I
I
as defined by Philips. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-08002 Rev. *D
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C65113C-SXC
CY7C65113C-SXCT
2
0.050[1.27]
C Patent Rights to use these components in an I
TYP.
14
15
Ordering Code
Ordering Information
Package Diagram
2
C components from Cypress, or one of its sublicensed Associated Companies, conveys a license under the Philips
0.697[17.70]
0.713[18.11]
0.013[0.33]
0.019[0.48]
28
PROM Size
1
0.291[7.39]
0.300[7.62]
0.004[0.10]
0.0118[0.30]
8 KB
8 KB
PIN 1 ID
28-Lead (300-Mil) Molded SOIC
0.026[0.66]
0.032[0.81]
0.092[2.33]
0.105[2.67]
0.394[10.01]
0.419[10.64]
*
2
C system, provided that the system conforms to the I
28-pin SOIC
28-pin SOIC-Tape Reel
SEATING PLANE
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.85gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
*
0.004[0.10]
Package Type
MIN.
MAX.
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
0.015[0.38]
0.050[1.27]
PART #
Commercial
Commercial
2
C Standard Specification
CY7C65113C
Operating Range
51-85026-*D
Page 48 of 49
0.0091[0.23]
0.0125[3.17]
*

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