TS86101G2BCGL E2V, TS86101G2BCGL Datasheet - Page 54

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TS86101G2BCGL

Manufacturer Part Number
TS86101G2BCGL
Description
Manufacturer
E2V
Datasheet

Specifications of TS86101G2BCGL

Lead Free Status / RoHS Status
Not Compliant
Table of Contents
e2v semiconductors SAS 2009
1
2
3
4
5
6
7
8
9
10 Definitions of Terms .............................................................................. 35
11 Thermal and Moisture Characteristics ................................................ 36
12 Applying the TS86101G2B MUXDAC ................................................... 37
Main Features............................................................................................ 1
Performance.............................................................................................. 1
Applications .............................................................................................. 2
Screening .................................................................................................. 2
Description ............................................................................................... 2
Specifications .......................................................................................... 2
Typical Characteristics ........................................................................... 9
Pin Description ...................................................................................... 17
Functional Description .......................................................................... 20
Main Features of the TS86101G2B ....................................................... 23
Block Diagram ........................................................................................ 28
Timing Diagram ...................................................................................... 29
Equivalent Input/Output Schematics ................................................... 31
2.1 Electrical Operating Characteristics ........................................................................ 4
2.2 Timing Characteristics ............................................................................................. 8
2.3 Explanation of Test Levels ...................................................................................... 9
5.1 Device Overview ................................................................................................... 20
5.2 Registering the Input Data ..................................................................................... 21
5.3 Phase Relationship Between Data Ready and CW_IN Clock Input ...................... 22
6.1 Input MUX ............................................................................................................. 23
6.2 Power-up Asynchronous Reset/Synchronization of Several TS86101G2B Devices 24
6.3 Programmable DSP Clock .................................................................................... 25
6.4 Diode Pin for Die Junction Temperature Monitoring Function ............................... 26
6.5 GA Pin ................................................................................................................... 27
12.1 Accessing Power Supplies .................................................................................. 37
12.2 Digital Inputs and Data Ready Signal Implementation ........................................ 39
TS86101G2B
0992D–BDC–04/09
i

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