BFU725F/N1,115 NXP Semiconductors, BFU725F/N1,115 Datasheet

TRANSISTOR NPN 40MA SOT343

BFU725F/N1,115

Manufacturer Part Number
BFU725F/N1,115
Description
TRANSISTOR NPN 40MA SOT343
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BFU725F/N1,115

Package / Case
SOT-343N
Transistor Type
NPN
Voltage - Collector Emitter Breakdown (max)
2.8V
Frequency - Transition
55GHz
Noise Figure (db Typ @ F)
0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Gain
10dB ~ 24dB
Power - Max
136mW
Dc Current Gain (hfe) (min) @ Ic, Vce
160 @ 10mA, 2V
Current - Collector (ic) (max)
40mA
Mounting Type
Surface Mount
Dc Collector/base Gain Hfe Min
40
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Configuration
Single
Transistor Polarity
NPN
Maximum Operating Frequency
55 GHz
Collector- Emitter Voltage Vceo Max
2.8 V
Emitter- Base Voltage Vebo
0.55 V
Continuous Collector Current
40 mA
Power Dissipation
136 mW
Maximum Operating Temperature
+ 150 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-5111-2
BFU725F/N1,115

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BFU725F/N1,115
Manufacturer:
ST
Quantity:
3 150
Part Number:
BFU725F/N1,115
Manufacturer:
NXP/恩智浦
Quantity:
20 000
1. Product profile
CAUTION
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
NPN silicon germanium microwave transistor for high speed, low noise applications in a
plastic, 4-pin dual-emitter SOT343F package.
I
I
I
I
I
I
I
I
I
I
Table 1.
Symbol Parameter
V
V
V
I
P
h
C
FE
CBO
CEO
EBO
tot
BFU725F/N1
NPN wideband silicon germanium RF transistor
Rev. 01 — 13 July 2009
Low noise high gain microwave transistor
Noise figure (NF) = 0.7 dB at 5.8 GHz
High maximum stable gain 27 dB at 1.8 GHz
110 GHz f
2nd LNA stage and mixer stage in DBS LNB’s
Satellite radio
Low noise amplifiers for microwave communications systems
WLAN and CDMA applications
Analog/digital cordless applications
Ka band oscillators (DRO’s)
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20 , IEC/ST 61340-5 , JESD625-A or
equivalent standards.
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
total power dissipation
DC current gain
Quick reference data
T
silicon germanium technology
Conditions
open emitter
open base
open collector
T
I
T
C
sp
j
= 25 C
= 10 mA; V
90 C
CE
= 2 V;
[1]
Min
-
-
-
-
-
160
Product data sheet
Typ
-
-
-
25
-
280
Max
10
2.8
0.55
40
136
400
Unit
V
V
V
mA
mW

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BFU725F/N1,115 Summary of contents

Page 1

BFU725F/N1 NPN wideband silicon germanium RF transistor Rev. 01 — 13 July 2009 1. Product profile 1.1 General description NPN silicon germanium microwave transistor for high speed, low noise applications in a plastic, 4-pin dual-emitter SOT343F package. CAUTION This device ...

Page 2

... NXP Semiconductors Table 1. Symbol Parameter C CBS p(max [2] G p(max) 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BFU725F/N1 4. Marking Table 4. Type number BFU725F/N1 BFU725F_N1_1 Product data sheet Quick reference data …continued Conditions collector-base V CB capacitance transition frequency mA GHz; T maximum power gain ...

Page 3

... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot T stg the temperature at the solder point of the emitter lead Thermal characteristics Table 6. Symbol R th(j-sp) Fig 1. BFU725F_N1_1 Product data sheet NPN wideband silicon germanium RF transistor ...

Page 4

... NXP Semiconductors 7. Characteristics Table 7. Characteristics unless otherwise specified. j Symbol Parameter V collector-base breakdown (BR)CBO voltage V collector-emitter breakdown (BR)CEO voltage I collector current C I collector-base cut-off current CBO h DC current gain FE C collector-emitter capacitance CES C emitter-base capacitance EBS C collector-base capacitance CBS f transition frequency ...

Page 5

... NXP Semiconductors Table 7. Characteristics …continued unless otherwise specified. j Symbol Parameter P output power gain L(1dB) compression IP3 third-order intercept point [ the maximum power gain p(max (mA 0.5 1.0 1.5 2 amb ( 110 100 (10 (11 Fig 2. Collector current as a function of collector-emitter voltage; typical values ...

Page 6

... NXP Semiconductors 160 C CBS (fF) 120 MHz amb Fig 4. Collector-base capacitance as a function of collector-base voltage; typical values amb ( 1.5 GHz ( 1.8 GHz ( 2.4 GHz ( 5.8 GHz ( GHz Fig 6. Gain as a function of collector current; typical value BFU725F_N1_1 Product data sheet NPN wideband silicon germanium RF transistor ...

Page 7

... NXP Semiconductors 50 G (dB) 40 MSG 30 2 IS21I mA amb Fig 7. Gain as a function of frequency; typical values 2.0 NF min (dB) 1.6 1.2 0.8 0 amb ( GHz ( 5.8 GHz ( 2.4 GHz ( 1.8 GHz ( 1.5 GHz Fig 9. Minimum noise figure as a function of collector current; typical values BFU725F_N1_1 ...

Page 8

... NXP Semiconductors 8. Package outline Plastic surface-mounted flat pack package; reverse pinning; 4 leads DIMENSIONS (mm are the original dimensions) A UNIT max 0.75 0.4 0.7 0.25 mm 0.65 0.3 0.5 0.10 OUTLINE VERSION IEC SOT343F Fig 11. Package outline SOT343F BFU725F_N1_1 Product data sheet scale 2.2 1 ...

Page 9

... NXP Semiconductors 9. Abbreviations Table 8. Acronym CDMA DBS DC DRO LNA LNB Ka NPN RF WLAN 10. Revision history Table 9. Revision history Document ID Release date BFU725F_N1_1 20090713 BFU725F_N1_1 Product data sheet NPN wideband silicon germanium RF transistor Abbreviations Description Code Division Multiple Access Direct Broadcast Satellite Direct Current Dielectric Resonator Oscillator Low Noise Amplifi ...

Page 10

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 11

... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Legal information ...

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