PIC18F8525-I/PT Microchip Technology, PIC18F8525-I/PT Datasheet - Page 376

• Manufacturer Part Number: PIC18F8525-I/PT
• Description: IC PIC MCU FLASH 24KX16 80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F8525-I/PT

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.75K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TFQFP
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3840 B
• Interface Type: MSSP, SPI, I2C, EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 69
• Number Of Timers: 2 x 8 bit
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16 bit
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18F6525/6621/8525/8621
29.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39612B-page 374
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-085
Package Details
B
c
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
β
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
(F)
n
p
E
D
B
α
A
φ
c
β
L
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
0
5
5
D1
φ
CH x 45°
INCHES
D
NOM
64
.020
.043
.006
.024
.472
.472
.394
.394
.007
.035
.039
.039
.009
A1
3.5
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.041
.011
.045
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
5
5
0
MILLIMETERS*
 2005 Microchip Technology Inc.
NOM
64
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
16
10
10
A2
MAX
α
12.25
12.25
10.10
10.10
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7