PIC18F8525-I/PT Microchip Technology, PIC18F8525-I/PT Datasheet - Page 24

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PIC18F8525-I/PT

Manufacturer Part Number
PIC18F8525-I/PT
Description
IC PIC MCU FLASH 24KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F8525-I/PT

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
MSSP, SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
69
Number Of Timers
2 x 8 bit
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163032
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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PIC18F6525/6621/8525/8621
TABLE 2-2:
An external clock source may also be connected to the
OSC1 pin in the HS, XT and LP modes as shown in
Figure 2-2.
FIGURE 2-2:
DS39612B-page 22
These values are for design guidance only.
See notes following this table.
Clock from
Ext. System
Note 1: Higher capacitance increases the stability
Mode
HS
LP
XT
200 kHz
2: R
3: Since each resonator/crystal has its own
32 kHz
1 MHz
of the oscillator but also increases the
start-up time.
HS mode, as well as XT mode, to avoid
overdriving crystals with low drive level
specification.
characteristics, the user should consult the
resonator/crystal manufacturer for appro-
priate values of external components or
verify oscillator performance.
S
20.0 MHz
25.0 MHz
32.0 kHz
Open
200 kHz
1.0 MHz
4.0 MHz
4.0 MHz
8.0 MHz
(see Figure 2-1) may be required in
Freq
CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR
Ranges Tested:
Crystals Used
EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR
LP OSCILLATOR
CONFIGURATION)
OSC1
OSC2
47-68 pF
15-33 pF
15-33 pF
15-33 pF
PIC18F6X2X/8X2X
33 pF
15 pF
15 pF
15 pF
C1
20 MHz
4 MHz
8 MHz
47-68 pF
15-33 pF
15-33 pF
15-33 pF
33 pF
15 pF
15 pF
15 pF
C2
2.3
For timing insensitive applications, the “RC” and
“RCIO” device options offer additional cost savings.
The RC oscillator frequency is a function of the supply
voltage, the resistor (R
values and the operating temperature. In addition to
this, the oscillator frequency will vary from unit to unit
due to normal process parameter variation. Further-
more, the difference in lead frame capacitance
between package types will also affect the oscillation
frequency, especially for low C
also needs to take into account variation due to
tolerance of external R and C components used.
Figure 2-3 shows how the R/C combination is
connected.
In the RC Oscillator mode, the oscillator frequency
divided by 4 is available on the OSC2 pin. This signal
may be used for test purposes or to synchronize other
logic.
FIGURE 2-3:
The RCIO Oscillator mode functions like the RC mode
except that the OSC2 pin becomes an additional
general purpose I/O pin. The I/O pin becomes bit 6 of
PORTA (RA6).
R
C
V
Recommended values:
EXT
EXT
SS
V
DD
RC Oscillator
F
OSC
/4
RC OSCILLATOR MODE
OSC1
OSC2/CLKO
 2005 Microchip Technology Inc.
3 kΩ ≤ R
C
EXT
EXT
) and capacitor (C
> 20 pF
PIC18F6X2X/8X2X
EXT
EXT
values. The user
≤ 100 kΩ
Internal
Clock
EXT
)

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