PIC18F8525-I/PT Microchip Technology, PIC18F8525-I/PT Datasheet - Page 328

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PIC18F8525-I/PT

Manufacturer Part Number
PIC18F8525-I/PT
Description
IC PIC MCU FLASH 24KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F8525-I/PT

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
MSSP, SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
69
Number Of Timers
2 x 8 bit
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163032
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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PIC18F6525/6621/8525/8621
27.2
DS39612B-page 326
PIC18LF6X2X/8X2X
PIC18F6X2X/8X2X
Legend:
Note 1:
Param
No.
(Industrial)
(Industrial, Extended)
2:
3:
4:
DC Characteristics: Power-Down and Supply Current
Power-Down Current (I
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all I
For RC oscillator configurations, current through R
by the formula Ir = V
The band gap reference is a shared resource used by both BOR and LVD modules. Enabling both modules will
consume less than the specified sum current of the modules.
PIC18LF6X2X/8X2X
PIC18LF6X2X/8X2X
Device
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
All devices
DD
DD
PD
/2R
; WDT enabled/disabled as specified.
)
(1)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
DD
EXT
PIC18F6X2X/8X2X (Industrial, Extended)
PIC18LF6X2X/8X2X (Industrial)
Typ
0.2
0.2
5.0
0.4
0.4
3.0
0.7
0.7
15
measurements in active operation mode are:
(mA) with R
Max
10
18
32
1
1
1
1
2
2
EXT
Units
µA
µA
µA
µA
µA
µA
µA
µA
µA
in kΩ.
EXT
is not included. The current through the resistor can be estimated
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
A
A
A
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
DD
Conditions
or V
SS
 2005 Microchip Technology Inc.
and all features that add delta
DD
;
(Sleep mode)
(Sleep mode)
(Sleep mode)
V
V
V
DD
DD
DD
= 2.0V,
= 3.0V,
= 5.0V,

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