TAJA225K006RNJ AVX Corporation, TAJA225K006RNJ Datasheet - Page 19

• Manufacturer Part Number: TAJA225K006RNJ
• Description: CAP TANT 2.2UF 6.3V 10% SMD
• Manufacturer: AVX Corporation
• Series: TAJr
• Type: Moldedr

Specifications of TAJA225K006RNJ

• Capacitance: 2.2µF
• Package / Case: 1206 (3216 Metric)
• Voltage - Rated: 6.3V
• Tolerance: ±10%
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Height: 0.063" (1.60mm)
• Manufacturer Size Code: A
• Features: General Purpose
• Tolerance (+ Or -): 10%
• Voltage: 6.3VDC
• Esr: 9Ohm
• Mounting Style: Surface Mount
• Polarity: Polar
• Construction: SMT Chip
• Case Style: Molded
• Case Code: A
• Lead Spacing (nom): Not Requiredmm
• Df: 6%
• Dcl: 0.5uA
• Seal: Not Required
• Insulation: Not Required
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 3.2mm
• Product Height (mm): 1.6mm
• Product Depth (mm): 1.6mm
• Product Diameter (mm): Not Requiredmm
• Seated Plane Height: Not Requiredmm
• Length W/weld (max): Not Requiredmm
• Operating Temp Range: -55C to 125C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Esr (equivalent Series Resistance): -
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant
• Other names: TAJA225K006R; TAJA225K006R

Technical Summary and
Application Guidelines
IR REFLOW
SECTION 4
APPLICATION GUIDELINES FOR TANTALUM CAPACITORS
Recommended soldering profiles for surface mounting of tantalum capacitors is provided in figure below.
WAVE SOLDERING
Recommended Ramp Rate Less than 2°C/sec.
LEAD FREE PROGRAM
AVX will implement a change to the termination finish on its
TAJ, THJ and TPS series surface mount tantalum capacitors
effective January 1, 2001.
After that date all products manufactured will utilize lead free
terminations.
The termination is compatible with the following lead free sol-
der pastes; SnCu, SnCuAg and SnCuAgBi.
It is also compatible with existing SnPb solder pastes /
systems in use today.
The recommended IR reflow profile is shown below.
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
a) The visual standards used for evaluation of solder joints
b) Resin color may darken slightly due to the increase in
c) Lead free solder pastes do not allow the same self align-
300
250
200
150
100
50
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
0
temperature required for the new pastes.
0
• Pre-heating: 150 15C / 60-90s
• Max. Peak Gradient 2.5C/s
• Peak Temperature: 240 5C
• Time at >230C: 40s Max.
LEAD FREE REFLOW PROFILE
50
100
150
200
250
300
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