EVAL-ADUM540XEBZ Analog Devices Inc, EVAL-ADUM540XEBZ Datasheet - Page 2

• Manufacturer Part Number: EVAL-ADUM540XEBZ
• Description: BOARD EVAL FOR ADUM540x
• Manufacturer: Analog Devices Inc

Specifications of EVAL-ADUM540XEBZ

• Main Purpose: Interface, Digital Isolator
• Embedded: No
• Utilized Ic / Part: ADuM540x, 520x, 500x, 130x, 131x, 140x, 141x, 240x, 330x, 340x
• Primary Attributes: Pads for 16-SOP iCoupler® Isolators, Support for Signal Wrap Back
• Secondary Attributes: Places for BNC Connectors for 50 Ohm Signals, Support for isoPower
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADuM5401/ADuM5402/ADuM5403/ADuM5404
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams ............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 9
REVISION HISTORY
11/08—Rev. 0 to Rev. A
Changes to Figure 1 and General Description Section ............... 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 5
Changes to Table 4 ............................................................................ 7
Changes to Table 6 and Table 7 ....................................................... 8
Changes to Table 8 and Table 9 ....................................................... 9
Changes to Figure 7 and Table 10 ................................................. 10
Changes to Figure 8 and Table 11 ................................................. 11
Changes to Figure 9 and Table 12 ................................................. 12
Changes to Figure 10 and Table 13 ............................................... 13
Moved Truth Table Section ........................................................... 13
Changes to Applications Information Section and PCB Layout
Section .............................................................................................. 17
Changes to DC Correctness and Magnetic Field Immunity
Section .............................................................................................. 18
Changes to Power Considerations Section ................................. 20
Added Increasing Available Power Section, Table 15, and
Table 16 ............................................................................................ 20
Electrical Characteristics—5 V Primary Input Supply/
5 V Secondary Isolated Supply ................................................... 3
Electrical Characteristics—3.3 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 5
Package Characteristics ............................................................... 7
Regulatory Approvals ................................................................... 7
Insulation and Safety-Related Specifications ............................ 7
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics .............................................................................. 8
Recommended Operating Conditions ...................................... 8
ESD Caution .................................................................................. 9
Rev. A | Page 2 of 24
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 14
Terminology .................................................................................... 16
Applications Information .............................................................. 17
Outline Dimensions ....................................................................... 22
5/08—Revision 0: Initial Version
Truth Table .................................................................................. 13
PCB Layout ................................................................................. 17
Thermal Analysis ....................................................................... 18
EMI Considerations ................................................................... 18
Propagation Delay-Related Parameters ................................... 18
DC Correctness and Magnetic Field Immunity ........................... 18
Power Consumption .................................................................. 19
Power Considerations ................................................................ 20
Increasing Available Power ....................................................... 20
Insulation Lifetime ..................................................................... 21
Ordering Guide .......................................................................... 22