ADZS-HPUSB-ICE Analog Devices Inc, ADZS-HPUSB-ICE Datasheet - Page 35

• Manufacturer Part Number: ADZS-HPUSB-ICE
• Description: TOOL EMULATOR USB HP CROSSCORE
• Manufacturer: Analog Devices Inc
• Type: In-Circuit Emulator Systemr

Specifications of ADZS-HPUSB-ICE

• Contents: HPUSB-ICE, JTAG Pod, Power Supply and Cable
• Silicon Family Name: Blackfin
• Core Architecture: Blackfin
• Ic Product Type: Emulator
• Kit Contents: USB-based Emulator W/ 14-pin JTAG Connector, USB Cable
• Features: USB 2.0, Up To 1.5MB/sec
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: ADSP-219x Blackfin®, SHARC® and TigerSHARC® DSPs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: ADZU-HPUSB-ICE; ADZU-HPUSB-ICE

Mechanical Specifications
HPPCI-ICE
HPUSB, USB, HPPCI and MSP430 Emulators User’s Guide
To ensure that the custom board’s JTAG interface is designed and laid out
correctly, refer to Engineer-to-Engineer Note, Analog Devices JTAG Emu-
lation Technical Reference (EE-68), available from the Analog Devices Web
site. This document is a technical reference for implementing the JTAG
interface on your target.
The HPPCI-ICE consists of a daughter board and a pod cable. The system
is compliant with revision 2.2 of the PCI specification and plugs into
5V-only motherboards. It uses only the 5 volts from the PC’s PCI slot.
The pod cable consists of a small PCB that has a multi-conductor cable
soldered at each end. The multi-conductor cable is constructed with indi-
vidual coaxial cables that are encapsulated by shield ground. The PCB in
the pod is fully enclosed in a copper-sprayed plastic enclosure. The
multi-conductor cables and copper spray reduce system noise and electro-
magnetic interference. The mechanical dimensions of the daughter board,
pod cable assembly, and pod enclosure are shown in
Figure
are in inches.
2-4, and
Figure
2-5, respectively. Unless specified, all dimensions
Hardware Description
Figure
2-3,
2-5