MCP3909EV-MCU16 Microchip Technology, MCP3909EV-MCU16 Datasheet - Page 4

• Manufacturer Part Number: MCP3909EV-MCU16
• Description: EVALUATION BOARD FOR MCP3909
• Manufacturer: Microchip Technology

Specifications of MCP3909EV-MCU16

• Number Of Adc's: 2
• Number Of Bits: 16
• Sampling Rate (per Second): 15k
• Data Interface: Serial
• Inputs Per Adc: 1 Differential
• Input Range: ±1 V
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: MCP3909
• Silicon Manufacturer: Microchip
• Application Sub Type: ADC
• Kit Application Type: Data Converter
• Silicon Core Number: MCP3909
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MCP3909 ADC Evaluation Board for 16-Bit MCUs User’s Guide
Appendix A. Schematics and Layouts
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .....................................................................................34
DS51777A-page iv
A.1 Introduction .................................................................................................. 21
A.2 Schematic - Analog ...................................................................................... 22
A.3 Schematic - LCD And UART ....................................................................... 23
A.4 Schematic - USB And Memory .................................................................... 24
A.5 Schematic - Microcontroller (MCU) .............................................................. 25
A.6 Schematic - PIM Module .............................................................................. 26
A.7 Schematic - Power ....................................................................................... 27
A.8 Board - Top Trace and Top Silk ................................................................... 28
A.9 Board - Bottom Trace and Bottom Silk ........................................................ 28
A.10 Board - Layer #2 VDD ................................................................................ 29
A.11 Board - Layer #3 GND ............................................................................... 29
A.12 Board -Top Silk and Pads .......................................................................... 30
A.13 Board - Bottom Silk and Pads .................................................................... 30
© 2008 Microchip Technology Inc.