IR3505ZMTRPBF International Rectifier, IR3505ZMTRPBF Datasheet - Page 19

• Manufacturer Part Number: IR3505ZMTRPBF
• Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3505ZMTRPBF

• Package / Case: 16-MLPQ
• Mounting Type: Surface Mount
• Current - Supply: 3mA
• Voltage - Supply: 8 V ~ 16 V
• Operating Temperature: 0°C ~ 125°C
• Applications: Processor
• Supply Voltage Range: 4.75V To 7.5V, 8V To 16V
• Operating Temperature Range: 0°C To +125°C
• Digital Ic Case Style: MLPQ
• No. Of Pins: 16
• Termination Type: SMD
• Function: For High Performance CPUs And ASICs
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Controller Type: XPhase
• Package: 16-Lead MLPQ
• Circuit: X-Phase Phase IC
• Iout (a): 2.5A Gate Driver
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stencil Design
• The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
• The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
• The land pad aperture should be approximately 70% area of solder on the center pad. If too much
• The maximum length and width of the land pad stencil aperture should be equal to the solder resist
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
land.
solder is deposited on the center pad the part will float and the lead lands will be open.
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
Page 19 of 20
March 17, 2009
IR3505Z