IR3505ZMTRPBF International Rectifier, IR3505ZMTRPBF Datasheet - Page 17
![IC XPHASE3 CTLR 2.5A 16-MLPQ](/photos/7/48/74809/16-mlpq_sml.jpg)
IR3505ZMTRPBF
Manufacturer Part Number
IR3505ZMTRPBF
Description
IC XPHASE3 CTLR 2.5A 16-MLPQ
Manufacturer
International Rectifier
Series
XPhase3™r
Datasheet
1.IR3505ZMTRPBF.pdf
(20 pages)
Specifications of IR3505ZMTRPBF
Package / Case
16-MLPQ
Mounting Type
Surface Mount
Current - Supply
3mA
Voltage - Supply
8 V ~ 16 V
Operating Temperature
0°C ~ 125°C
Applications
Processor
Supply Voltage Range
4.75V To 7.5V, 8V To 16V
Operating Temperature Range
0°C To +125°C
Digital Ic Case Style
MLPQ
No. Of Pins
16
Termination Type
SMD
Function
For High Performance CPUs And ASICs
Rohs Compliant
Yes
Filter Terminals
SMD
Controller Type
XPhase
Package
16-Lead MLPQ
Circuit
X-Phase Phase IC
Iout (a)
2.5A Gate Driver
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IR3505ZMTRPBF
Manufacturer:
IR
Quantity:
20 000
PCB Metal and Component Placement
• Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should
• Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm
• Center pad land length and width should be equal to maximum part pad length and width. However, the
• Four 0.3mm diameter vias shall be placed in the pad land spaced at 0.85mm, and connected to ground
• No PCB traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so
be ≥ 0.2mm to minimize shorting.
inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard
extension will accommodate any part misalignment and ensure a fillet.
minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥
0.23mm for 3 oz. Copper)
to minimize the noise effect on the IC, and to transfer heat to the PCB
can cause the IC to rise up from the PCB resulting in poor solder joints to the IC leads.
Page 17 of 20
March 17, 2009
IR3505Z