FAN7390M Fairchild Semiconductor, FAN7390M Datasheet - Page 5
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FAN7390M
Manufacturer Part Number
FAN7390M
Description
IC GATE DRIVER HI LOW SIDE 8-SOP
Manufacturer
Fairchild Semiconductor
Type
High Side/Low Sider
Datasheet
1.FAN7390MX.pdf
(15 pages)
Specifications of FAN7390M
Configuration
High and Low Side, Synchronous
Input Type
Non-Inverting
Delay Time
140ns
Current - Peak
4.5A
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
600V
Voltage - Supply
10 V ~ 22 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Product
Driver ICs - Various
Rise Time
50 ns
Fall Time
50 ns
Supply Voltage (min)
10 V
Maximum Power Dissipation
625 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Bridge Type
Half Bridge
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FAN7390M1X
Manufacturer:
WALSIN
Quantity:
46 000
Part Number:
FAN7390MX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T
Notes:
1. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
2. Refer to the following standards:
3. Do not exceed P
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
JESD51-2: Integral circuits thermal test method environmental conditions - natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
Symbol
Symbol
P
dV
D
T
V
V
V
V
V
V
V
V
V
(1, 2, 3)
θ
V
V
V
V
T
T
STG
HO
DD
HO
DD
LO
LO
SS
S
JA
IN
IN
A
B
S
S
B
J
/dt
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Low-Side and Logic Supply Voltage
Low-Side Output Voltage
Logic Input Voltage (HIN and LIN)
High-Side Floating Supply Offset Voltage
High-Side Floating Supply Voltage
High-Side Floating Output Voltage HO
Low-Side and Logic Fixed Supply Voltage
Low-Side Output Voltage LO
Logic Input Voltage (HIN and LIN)
Logic Ground (FAN7390M1 only)
Allowable Offset Voltage Slew Rate
Power Dissipation
Thermal Resistance, Junction-to-Ambient
Junction Temperature
Storage Temperature
Operating Ambient Temperature
D
under any circumstances.
Characteristics
Parameter
A
=25°C, unless otherwise specified.
5
14-SOIC
14-SOIC
V
V
V
8-SOP
8-SOP
V
8-DIP
8-DIP
Min.
B
SS
DD
-0.3
-0.3
-0.3
S
-25.0
-0.3
-0.3
-25
V
6-V
COM
Min.
V
S
-40
V
10
+10
SS
S
DD
V
V
V
V
V
Max.
625.0
DD
DD
DD
0.625
+150
+150
25.0
1.25
B
B
100
200
110
1.0
50
+0.3
+0.3
+0.3
+0.3
+0.3
V
Max.
+125
V
V
600
S
V
22
+22
DD
DD
B
www.fairchildsemi.com
°C/W
Unit
V/ns
°C
°C
Unit
W
V
V
V
V
V
V
V
°C
V
V
V
V
V
V