FAN7842MX Fairchild Semiconductor, FAN7842MX Datasheet - Page 4

• Manufacturer Part Number: FAN7842MX
• Description: IC DRIVER HIGH/LOW GATE 8-SOP
• Manufacturer: Fairchild Semiconductor
• Type: High and Low Side Gate Driverr

Specifications of FAN7842MX

• Configuration: Half Bridge
• Input Type: Non-Inverting
• Delay Time: 170ns
• Current - Peak: 350mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 200V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Drivers: 2
• Driver Configuration: Non-Inverting
• Driver Type: High and Low Side
• Input Logic Level: TTL
• Rise Time: 140ns
• Fall Time: 80ns
• Propagation Delay Time: 300ns
• Operating Supply Voltage (max): 20V
• Peak Output Current: 650uA
• Power Dissipation: 625mW
• Operating Supply Voltage (min): 10V
• Turn Off Delay Time: 50fs
• Turn On Delay Time (max): 50ns
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOP
• Product: Half-Bridge Drivers
• Supply Voltage (max): 25 V
• Supply Voltage (min): - 0.3 V
• Supply Current: 0.6 mA
• Maximum Power Dissipation: 0.625 W
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Full Bridge, Half Bridge
• Maximum Turn-off Delay Time: 300 ns
• Maximum Turn-on Delay Time: 300 ns
• Minimum Operating Temperature: - 40 C
• Output Current: 350 mA to 650 mA
• Supply Voltage Range: 10V To 20V
• Device Type: High Side / Low Side
• Termination Type: SMD
• Driver Case Style: SOP
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Supply Voltage Min: 10V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FAN7842MXTR

FAN7842 Rev. 1.0.2
© 2006 Fairchild Semiconductor Corporation
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T
Note:
2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
3. Refer to the following standards:
4. Do not exceed P
Recommended Operating Ratings
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
P
Symbol
Symbol
JESD51-2: Integral circuits thermal test method environmental conditions - natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
dVs/dt
D
COM
T
V
V
V
V
V
(2)(3)(4)
V
V
θ
V
V
V
V
V
STG
T
T
HO
HO
CC
JA
LO
CC
LO
IN
IN
A
S
B
J
B
S
High-side offset voltage
High-side floating supply voltage
High-side floating output voltage HO
Low-side and logic fixed supply voltage
Low-side output voltage LO
Logic input voltage (HIN, LIN)
Logic ground
Allowable offset voltage slew rate
Power dissipation
Thermal resistance, junction-to-ambient
Junction temperature
Storage temperature
High-side floating supply voltage
High-side floating supply offset voltage
High-side (HO) output voltage
Low-side (LO) output voltage
Logic input voltage (HIN, LIN)
Low-side supply voltage
Ambient temperature
D
under any circumstances.
Parameter
Parameter
A
=25°C unless otherwise specified.
4
V
V
V
6-V
V
COM
COM
Min.
Min
CC
-0.3
-0.3
-0.3
-0.3
S
S
-40
B
V
10
-0.3
+10
-25
S
-25
CC
.
V
V
V
V
V
V
0.625
Max.
Max
CC
CC
CC
V
V
B
B
125
225
200
150
150
S
200
V
25
50
20
+0.3
+0.3
+20
CC
CC
+0.3
+0.3
+0.3
B
.
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°C/W
Unit
Unit
V/ns
°C
°C
°C
W
V
V