FAN7361MX Fairchild Semiconductor, FAN7361MX Datasheet - Page 4

• Manufacturer Part Number: FAN7361MX
• Description: IC DRIVER GATE HIGH SIDE 8SOIC
• Manufacturer: Fairchild Semiconductor
• Type: High Sider

Specifications of FAN7361MX

• Configuration: High-Side
• Input Type: Non-Inverting
• Delay Time: 120ns
• Current - Peak: 250mA
• Number Of Configurations: 1
• Number Of Outputs: 1
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Rise Time: 160 ns
• Fall Time: 100 ns
• Supply Voltage (min): 10 V
• Supply Current: 0.55 mA
• Maximum Power Dissipation: 625 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 1
• Supply Voltage Range: 10V To 20V
• Device Type: High Side
• Termination Type: SMD
• Driver Case Style: SOP
• No. Of Pins: 8
• Peak Output Current: 500mA
• Operating Temperature Range: -40°C To +125°C
• Supply Voltage Min: 10V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FAN7361MXTR; FAN7361MX_NL; FAN7361MX_NLTR; FAN7361MX_NLTR

FAN7361, FAN7362 Rev. 1.0.8
© 2005 Fairchild Semiconductor Corporation
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T
Notes:
2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
3. Refer to the following standards:
4. Do not exceed P
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
P
Symbol
Symbol
JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
dV
D
V
V
V
V
(2)(3)(4)
V
θ
V
V
V
V
V
T
T
T
HO
HO
CC
S
JA
CC
IN
IN
S
A
B
S
S
B
J
/dt
High-Side Offset Voltage
High-Side Floating Supply Voltage
High-Side Floating Output Voltage
Logic Fixed Supply Voltage
Logic Input Voltage
Allowable Offset Voltage Slew Rate
Power Dissipation
Thermal Resistance, Junction-to-Ambient
Junction Temperature
Storage Temperature
Ambient Temperature
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Logic Input Voltage
Logic Supply Voltage
D
under any circumstances.
Characteristics
Parameter
A
=25°C, unless otherwise specified.
4
V
V
6-V
V
Min.
GND
Min.
-0.3
-0.3
-0.3
S
S
-40
B
V
10
-0.3
+10
-25
S
CC
V
V
V
V
0.625
Max.
Max.
CC
+150
+150
+125
± 50
V
B
B
625
200
S
600
V
25
20
+0.3
+0.3
+20
CC
+0.3
B
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°C/W
Unit
Unit
V/ns
°C
°C
°C
W
V
V