MT48H4M16LFB4-10 Micron Technology Inc, MT48H4M16LFB4-10 Datasheet - Page 48

IC SDRAM 64MBIT 100MHZ 54VFBGA

MT48H4M16LFB4-10

Manufacturer Part Number
MT48H4M16LFB4-10
Description
IC SDRAM 64MBIT 100MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48H4M16LFB4-10

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
64M (4M x 16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
4Mx16
Density
64Mb
Address Bus
14b
Access Time (max)
8/7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
50mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
MT48H4M16LFB4-10
Manufacturer:
MICRON
Quantity:
4 000
Part Number:
MT48H4M16LFB4-10
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48H4M16LFB4-10 IT
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48H4M16LFB4-10 IT TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48H4M16LFB4-10 TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48H4M16LFB4-10:H
Manufacturer:
MICRON
Quantity:
4 000
NOTE:
NOTE:
pdf: 09005aef80a63953, source: 09005aef808a7edc
Y25L_64Mb_2.fm - Rev. E 11/04 EN
1. For this example, the burst length = 4.
2. A9 and A11 = “Don’t Care.”
1. CAS latency indicated in parentheses.
SYMBOL
t
t
t
t
AC (3)
AC (2)
CK (3)
CK (2)
t
t
t
t
CKH
t
t
CKS
AH
CH
AS
CL
DQMU, DQML
COMMAND
A0-A9, A11
BA0, BA1
1
CKE
A10
CLK
DQ
MIN MAX MIN
2.5
9.6
2.5
1
3
3
8
1
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
-8
T0
ROW
ROW
BANK
t CMH
t CKH
t AH
t AH
t AH
100
100
7
8
t RCD
t RAS
t RC
t CK
T1
2.5
9.6
2.5
NOP
12
1
3
3
1
Figure 44: WRITE – With Auto Precharge
-10
ENABLE AUTO PRECHARGE
MAX
t CMS
t CL
100
100
t DS
COLUMN m 2
7
8
WRITE
T2
BANK
D
IN
t CMH
t CH
t DH
m
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t DS
D
IN
T3
NOP
m + 1
t DH
t DS
D
IN
T4
NOP
m + 2
t DH
48
SYMBOL
t
t DS
t
WR (m)
WR (a)
t
D
t
t
t
CMH
CMS
t
IN
RCD
T5
t
RAS
t
t
NOP
DH
DS
RC
RP
m + 3
t DH
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t WR
T6
NOP
1 CLK
+7ns
MIN
2.5
2.5
48
80
19
19
15
1
1
-8
120,000
T7
NOP
MAX
1
MOBILE SDRAM
©2003 Micron Technology, Inc. All rights reserved.
t RP
NOP
T8
1 CLK
MIN
+5ns
100
2.5
2.5
50
20
20
15
1
1
64Mb: x16
-10
DON’T CARE
ACTIVE
ROW
ROW
BANK
120,000
T9
MAX
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns

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