M25PE20-VMN6TP NUMONYX, M25PE20-VMN6TP Datasheet - Page 21

IC FLASH 2MBIT 75MHZ 8SOIC

M25PE20-VMN6TP

Manufacturer Part Number
M25PE20-VMN6TP
Description
IC FLASH 2MBIT 75MHZ 8SOIC
Manufacturer
NUMONYX
Series
Forté™r
Datasheet

Specifications of M25PE20-VMN6TP

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
2M (256K x 8)
Speed
75MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Cell Type
NOR
Density
2Mb
Access Time (max)
8ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
SOIC N
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
256K
Supply Current
8mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
M25PE20-VMN6TPTR

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M25PE20, M25PE10
6
Instructions
All instructions, addresses and data are shifted in and out of the device, most significant bit
first.
Serial Data input (D) is sampled on the first rising edge of Serial Clock (C) after Chip Select
(S) is driven Low. Then, the one-byte instruction code must be shifted into the device, most
significant bit first, on Serial Data input (D), each bit being latched on the rising edges of
Serial Clock (C).
The instruction set is listed in
Every instruction sequence starts with a one-byte instruction code. Depending on the
instruction, this might be followed by address bytes, or by data bytes, or by both or none.
In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed (Fast_Read),
Read Status Register (RDSR) or Read to Lock Register (RDLR) instruction, the shifted-in
instruction sequence is followed by a data-out sequence. Chip Select (S) can be driven High
after any bit of the data-out sequence is being shifted out.
In the case of a Page Write (PW), Page Program (PP), Page Erase (PE), SubSector Erase
(SSE), Sector Erase (SE), Bulk Erase (BE), Write Enable (WREN), Write Disable (WRDI),
Write Status Register (WRSR), Write to Lock Register (WRLR), Deep Power-down (DP) or
Release from Deep Power-down (RDP) instruction, Chip Select (S) must be driven High
exactly at a byte boundary, otherwise the instruction is rejected, and is not executed. That is,
Chip Select (S) must driven High when the number of clock pulses after Chip Select (S)
being driven Low is an exact multiple of eight.
All attempts to access the memory array during a Write cycle, Program cycle or Erase cycle
are ignored, and the internal Write cycle, Program cycle or Erase cycle continues
unaffected.
Table
7.
Instructions
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