FDC6392S_Q Fairchild Semiconductor, FDC6392S_Q Datasheet - Page 3

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FDC6392S_Q

Manufacturer Part Number
FDC6392S_Q
Description
MOSFET 20V P-Ch PowerTrench Integrated
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FDC6392S_Q

Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
- 20 V
Gate-source Breakdown Voltage
+/- 12 V
Continuous Drain Current
- 2.2 A
Resistance Drain-source Rds (on)
0.15 Ohms
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SSOT-6
Fall Time
11 ns
Forward Transconductance Gfs (max / Min)
6 S
Minimum Operating Temperature
- 55 C
Power Dissipation
0.96 W
Rise Time
11 ns
Typical Turn-off Delay Time
13 ns
Notes:
1. R
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
Electrical Characteristics
the drain pins. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
θJC
is guaranteed by design while R
a) 130 °C/W when
mounted on a 0.125
in
copper.
2
pad of 2 oz.
θCA
is determined by the user's board design.
T
A
b) 140°C/W when mounted
= 25°C unless otherwise noted
on a .004 in
copper
2
pad of 2 oz
c) 180°C/W when mounted on a
minimum pad.
FDC6392S Rev C(W)

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