BUK9628-100A /T3 NXP Semiconductors, BUK9628-100A /T3 Datasheet - Page 4

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BUK9628-100A /T3

Manufacturer Part Number
BUK9628-100A /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9628-100A /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 10 V
Continuous Drain Current
49 A
Resistance Drain-source Rds (on)
0.027 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
106 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
166 W
Rise Time
58 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
250 ns
Part # Aliases
BUK9628-100A,118
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK9628-100A
Product data sheet
Symbol
R
R
Fig 5.
Fig 6.
th(j-mb)
th(j-a)
unclamped inductive load
Single-shot avalanche rating; avalanche current as a function of avalanche period
Transient thermal impedance from junction to mounting base as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
Z
(K/W)
th(j-mb)
I
(A)
AS
10
10
10
10
10
−1
−2
−3
1
2
10
10
1
−6
-3
All information provided in this document is subject to legal disclaimers.
δ = 0.5
T
j
prior to avalanche150 °C
0.05
0.02
0.2
0.1
10
0
−5
10
Rev. 02 — 26 April 2011
10
-2
−4
Conditions
minimum footprint ; FR4 board
10
−3
10
-1
10
−2
P
10
25 °C
t
p
−1
1
T
t
AV
003aaf236
003aaf223
1
δ =
(ms)
t
p
N-channel TrenchMOS logic level FET
(s)
T
t
t
p
10
10
BUK9628-100A
Min
-
-
Typ
-
50
© NXP B.V. 2011. All rights reserved.
-
Max
0.9
Unit
K/W
K/W
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