MT48LC2M32B2TG-7:G TR Micron Technology Inc, MT48LC2M32B2TG-7:G TR Datasheet - Page 44
![IC SDRAM 64MBIT 143MHZ 86TSOP](/photos/7/22/72264/557-86-tsop_sml.jpg)
MT48LC2M32B2TG-7:G TR
Manufacturer Part Number
MT48LC2M32B2TG-7:G TR
Description
IC SDRAM 64MBIT 143MHZ 86TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC2M32B2P-6G_TR.pdf
(69 pages)
Specifications of MT48LC2M32B2TG-7:G TR
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (2Mx32)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
86-TSOP
Package
86TSOP-II
Density
64 Mb
Address Bus Width
13 Bit
Operating Supply Voltage
3.3 V
Maximum Clock Rate
143 MHz
Maximum Random Access Time
17|8|5.5 ns
Organization
2Mx32
Address Bus
13b
Access Time (max)
17/8/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
160mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
557-1076-2
Table 12:
Table 13:
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
Revision
Die
G
Temperature Limits
Thermal Impedance Simulated Values
Package
90-ball
86-pin
FBGA
TSOP
Notes:
Notes:
Substrate
1. MAX operating case temperature, T
2. Device functionality is not guaranteed if the device exceeds maximum T
3. All temperature specifications must be satisfied.
4. The case temperature should be measured by gluing a thermocouple to the top center of
5. Operating ambient temperature surrounding the package.
1. For designs expected to last beyond the die revision listed, contact Micron Applications
2. Thermal resistance data is sampled from multiple lots and the values should be viewed as
3. These are estimates; actual results may vary.
Parameter
Operating case temperature:
Commercial
Industrial
Automotive
Junction temperature:
Commercial
Industrial
Automotive
Ambient temperature:
Commercial
Industrial
Automotive
Peak reflow temperature
4-layer
2-layer
4-layer
side of the device, as shown in Figures 31 and 32 on page 45.
the component. This should be done with a 1mm bead of conductive epoxy, as defined by
the JEDEC EIA/JESD51 standards. Care should be taken to ensure the thermocouple bead is
touching the case.
Engineering to confirm thermal impedance values.
typical.
Airflow = 0m/s
θ JA (°C/W)
66.6
70.6
54
44
Airflow = 1m/s
θ JA (°C/W)
Symbol
C
57.7
57.6
47.3
T
, is measured in the center of the package on the top
PEAK
T
T
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T
A
C
J
Min
Airflow = 2m/s
–40
–40
–40
–40
–40
–40
0
0
0
–
θ JA (°C/W)
54.6
69.5
52.7
Electrical Specifications
Max
105
110
105
260
80
90
85
95
70
85
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
(°C/W)
θ JB
53.6
35.7
35.2
Units
C
°C
°C
°C
°C
during operation.
1, 2, 3, 4
(°C/W)
Notes
12.7
7.95
θ JC
3, 5
3