LPC1788FBD144,551 NXP Semiconductors, LPC1788FBD144,551 Datasheet - Page 112

• Manufacturer Part Number: LPC1788FBD144,551
• Description: 8-bit Microcontrollers - MCU CORTEX-M3 512KB FL 96KB SRAM 4KB EE USB
• Manufacturer: NXP Semiconductors

Specifications of LPC1788FBD144,551

• Rohs: yes
• Factory Pack Quantity: 60

NXP Semiconductors
LPC178X_7X
Product data sheet
Fig 46. Reflow soldering of the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 4.1 — 15 November 2012
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC178x/7x
© NXP B.V. 2012. All rights reserved.
sot570-2_fr
SOT570-2
112 of 120