LPC1788FBD144,551 NXP Semiconductors, LPC1788FBD144,551 Datasheet - Page 108

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LPC1788FBD144,551

Manufacturer Part Number
LPC1788FBD144,551
Description
8-bit Microcontrollers - MCU CORTEX-M3 512KB FL 96KB SRAM 4KB EE USB
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1788FBD144,551

Rohs
yes
Factory Pack Quantity
60
NXP Semiconductors
Fig 42. TFBGA208 package
LPC178X_7X
Product data sheet
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT950-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
T
P
K
H
F
D
B
G
U
R
N
L
J
E
C
A
0.8
0.6
A
2
1
IEC
2
0.5
0.4
3
b
4
5
15.1
14.9
6
D
e
7
8
15.1
14.9
e
D
9
JEDEC
E
1
All information provided in this document is subject to legal disclaimers.
10
- - -
11
REFERENCES
12
0.8
e
Rev. 4.1 — 15 November 2012
13
0
14
12.8
15
e
b
1
16
17
12.8
JEITA
e
2
scale
5
B
e
0.15
∅ v
∅ w
v
e
A
E
M
M
2
0.08
C
C
w
A
10 mm
B
0.12
y
A
32-bit ARM Cortex-M3 microcontroller
0.1
y
A
1
2
A
1
y
1
PROJECTION
EUROPEAN
C
detail X
LPC178x/7x
C
X
y
© NXP B.V. 2012. All rights reserved.
ISSUE DATE
06-06-01
06-06-14
SOT950-1
108 of 120

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