MK10DN64VLF5 Freescale Semiconductor, MK10DN64VLF5 Datasheet - Page 22

• Manufacturer Part Number: MK10DN64VLF5
• Description: ARM Microcontrollers - MCU Kinetis 64K
• Manufacturer: Freescale Semiconductor

Specifications of MK10DN64VLF5

• Rohs: yes
• Core: ARM Cortex M4
• Processor Series: K10P32M50SF0
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 16 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: LQFP-48
• Mounting Style: SMD/SMT

Peripheral operating requirements and behaviors
1.
2.
3.
5.
6.
7.
6 Peripheral operating requirements and behaviors
6.1 Core modules
22
Single-layer
(1s)
Four-layer
(2s2p)
—
—
—
Board type
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
R
R
R
R
Ψ
Symbol
θJMA
θJMA
θJB
θJC
JT
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
board
Thermal
resistance,
junction to case
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
Description
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
58
40
24
18
3
48 LQFP
66
23
11
1.4
4
48 QFN
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor, Inc.
1,3
,
5
6
7
Notes