A42MX09-1TQG176M Microsemi, A42MX09-1TQG176M Datasheet - Page 23

• Manufacturer Part Number: A42MX09-1TQG176M
• Description: Ic Fpga Mx Sgl Chip 14k 176-Tqfp
• Manufacturer: Microsemi

Parameter Measurement
Figure 1-19 • Output Buffer Delays
Figure 1-20 • AC Test Loads
In
PAD
V
(Used to measure propagation delay)
OL
To the output under test
t DLH
50%
50%
1.5V
V
OH
Load 1
t DHL
1.5V
35 pF
E
PAD
D
TRIBUFF
t ENZL
50%
V
To the output under test
CCI
E
1.5V
50%
V
OL
v3.1
t ENLZ
PAD
10%
(Used to measure rising/falling edges)
T o AC test loads (shown below)
E
PAD
GND
40MX and 42MX Automotive FPGA Families
V
CCI
Load 2
t ENZH
50%
R to V
R to GND for t
R = 1 k Ω
GND
35 pF
1.5V
50%
V
OH
CCI
t ENHZ
for t
90%
PLZ
PHZ
/t
PZL
/t
PZH
1-19