SI8497DB-T2-E1 VISHAY [Vishay Siliconix], SI8497DB-T2-E1 Datasheet - Page 8

• Manufacturer Part Number: SI8497DB-T2-E1
• Description: P-Channel 30 V (D-S) MOSFET
• Manufacturer: VISHAY [Vishay Siliconix]

Si8497DB
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (2 x 3, 0.5 mm PITCH)
Notes (unless otherwise specified):
1. All dimensions are in millimeters.
2. Six (6) solder bumps are lead (Pb)-free 95.5Sn, 3.8Ag, 0.7Cu with diameter 0.30 to 0.32 mm.
3. Backside surface is coated with a Ti/Ni/Ag layer.
4. Non-solder mask defined copper landing pad.
5.
Note:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see
www.vishay.com
8
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
·
is location of pin 1.
Dim.
A
A
A
b
D
E
e
s
1
2
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0.510
0.220
0.290
0.300
0.230
0.920
1.420
Min.
1
2
Mark on Backside of Die
Recommended Land
A
8497
e
Millimeters
6 x Ø 0.24 to 0.26 Note 3
Solder Mask ~ Ø 0.25
.
B
XXX
Nom.
0.575
0.250
0.300
0.310
0.500
0.250
0.960
1.460
This document is subject to change without notice.
e
C
a
0.590
0.280
0.310
0.320
0.270
1.000
1.500
Max.
s
D
D
e
Bump Note 2
6 x Ø b
S
S
E
e
0.0201
0.0087
0.0114
0.0118
0.0090
0.0362
0.0559
Min.
G
S
s
Inches
0.0224
0.0098
0.0118
0.0122
0.0197
0.0098
0.0378
0.0575
Nom.
S11-1385-Rev. A, 11-Jul-11
Document Number: 63355
www.vishay.com/doc?91000
0.0110
0.0122
0.0126
0.0106
0.0394
0.0591
0.0232
Max.