SI8497DB-T2-E1 VISHAY [Vishay Siliconix], SI8497DB-T2-E1 Datasheet
SI8497DB-T2-E1
Related parts for SI8497DB-T2-E1
SI8497DB-T2-E1 Summary of contents
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... Device Marking: 8497 xxx = Date/Lot Traceability Code Ordering Information: Si8497DB-T2-E1 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS (T Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (T = 150 °C) J Pulsed Drain Current (t = 300 µs) Continuous Source-Drain Diode Current Maximum Power Dissipation ...
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... Si8497DB Vishay Siliconix THERMAL RESISTANCE RATINGS Parameter a, b Maximum Junction-to-Ambient c Maximum Junction-to-Case (Drain) Notes: a. Surface Mounted on 1" x 1" FR4 board. b. Maximum under Steady State conditions is 85 °C/W. c. Case is defined as top surface of the package. SPECIFICATIONS ( °C, unless otherwise noted) ...
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... Test Conditions ° 1 1.5 A, dI/dt = 100 A/µ ° This document is subject to change without notice. Si8497DB Vishay Siliconix Min. Typ. Max. Unit - 0. www.vishay.com 3 www.vishay.com/doc?91000 ...
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... Si8497DB Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted thru 2 0 Drain-to-Source Voltage (V) DS Output Characteristics 0. 0.16 0. 0.04 0. Drain Current (A) D On-Resistance vs. Drain Current and Gate Voltage 1 ...
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... A DC BVDSS Limited 0 Drain-to-Source Voltage ( > minimum V at which R is specified GS GS DS(on) Safe Operating Area, Junction-to-Ambient This document is subject to change without notice. Si8497DB Vishay Siliconix 125 ° ° Gate-to-Source Voltage ( ...
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... Si8497DB Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted 100 T - Case Temperature (°C) C Current Derating* * The power dissipation P is based J(max) dissipation limit for cases where additional heatsinking is used used to determine the current rating, when this rating falls below the package limit ...
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... THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH Square Wave Pulse Duration ( Square Wave Pulse Duration (s) This document is subject to change without notice. Si8497DB Vishay Siliconix Notes Duty Cycle ...
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... Si8497DB Vishay Siliconix PACKAGE OUTLINE MICRO FOOT: 6-BUMP ( 0.5 mm PITCH Recommended Land 8497 Mark on Backside of Die Notes (unless otherwise specified): 1. All dimensions are in millimeters. 2. Six (6) solder bumps are lead (Pb)-free 95.5Sn, 3.8Ag, 0.7Cu with diameter 0.30 to 0.32 mm. ...
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... Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’ ...