K4T1G084QD SAMSUNG [Samsung semiconductor], K4T1G084QD Datasheet - Page 21
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K4T1G084QD
Manufacturer Part Number
K4T1G084QD
Description
1Gb D-die DDR2 SDRAM Specification
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.K4T1G084QD.pdf
(27 pages)
1. Slew Rate Measurement Levels
2. DDR2 SDRAM AC timing reference load
3. DDR2 SDRAM output slew rate test load
K4T1G084QD
K4T1G164QD
14.0 General notes, which may apply for all AC parameters
other simulation tools to correlate the timing reference load to a system environment. Manufacturers will correlate to their production test conditions
(generally a coaxial transmission line terminated at the tester electronics).
The output timing reference voltage level for single ended signals is the crosspoint with VTT. The output timing reference voltage level for differential
signals is the crosspoint of the true (e.g. DQS) and the complement (e.g. DQS) signal.
Following figure represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended to be either a precise
representation of the typical system environment or a depiction of the actual load presented by a production tester. System designers will use IBIS or
a. Output slew rate for falling and rising edges is measured between VTT - 250 mV and VTT + 250 mV for
b. Input slew rate for single ended signals is measured from dc-level to ac-level: from VIL(dc) to VIH(ac) for rising edges and from VIH(dc) and VIL(ac)
c. VID is the magnitude of the difference between the input voltage on CK and the input voltage on CK, or between DQS and DQS for differential strobe.
Output slew rate is characterized under the test conditions as shown in the following figure.
+500mV. Output slew rate is guaranteed by design, but is not necessarily tested on each device.
for falling edges.
for falling edges).
single ended signals. For differential signals (e.g. DQS - DQS) output slew rate is measured between DQS - DQS = -500 mV and DQS - DQS =
For differential signals (e.g. CK - CK) slew rate for rising edges is measured from CK - CK = -250 mV to CK - CK = +500 mV (250mV to -500 mV
VDDQ
VDDQ
DUT
DUT
RDQS, RDQS
DQS, DQS
RDQS
RDQS
DQS
DQS
DQ
DQ
<AC Timing Reference Load>
Output
Output
<Slew Rate Test Load>
Test point
Timing
reference
point
19 of 29
25
25
Ω
W
V
V
TT
TT
= V
= V
DDQ
DDQ
/2
/2
Rev. 1.0 March 2007
DDR2 SDRAM