AM41DL6408H8H70IS AMD [Advanced Micro Devices], AM41DL6408H8H70IS Datasheet - Page 55

• Manufacturer Part Number: AM41DL6408H8H70IS
• Description: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
• Manufacturer: AMD [Advanced Micro Devices]

AC CHARACTERISTICS
November 24, 2003
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SADD = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
4. Waveforms are for the word mode.
Figure 28. Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings
Addresses
RESET#
RY/BY#
CE#f
WE#
Data
OE#
t
RH
555 for program
2AA for erase
A D V A N C E
t
t
t
WS
WC
WH
A0 for program
55 for erase
t
GHEL
t
t
t
DS
CP
PA for program
SADD for sector erase
555 for chip erase
CPH
t
AS
t
DH
Am41DL6408H
t
AH
I N F O R M A T I O N
OUT
PD for program
30 for sector erase
10 for chip erase
is the data written to the device.
t
BUSY
t
WHWH1 or 2
Data# Polling
DQ7#
PA
D
OUT
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