LPC1113 NXP [NXP Semiconductors], LPC1113 Datasheet - Page 58

• Manufacturer Part Number: LPC1113
• Description: 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash and 8 kB SRAM
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
LPC1111_12_13_14
Product data sheet
Fig 36. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 5 — 22 June 2011
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
LPC1111/12/13/14
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2011. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
58 of 64