LPC1113 NXP [NXP Semiconductors], LPC1113 Datasheet - Page 57
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LPC1113
Manufacturer Part Number
LPC1113
Description
32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash and 8 kB SRAM
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.LPC1113.pdf
(64 pages)
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NXP Semiconductors
13. Soldering
LPC1111_12_13_14
Product data sheet
Fig 35. Reflow soldering of the LQFP48 package
Footprint information for reflow soldering of LQFP48 package
DIMENSIONS in mm
0.500
P1
0.560
P2
10.350
Hy
Ax
solder land
occupied area
Gy
10.350 7.350
Ay
C
Bx
7.350
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
0.280
Rev. 5 — 22 June 2011
Generic footprint pattern
D1
P1
0.500
D2
Hx
Gx
Bx
Ax
7.500
Gx
7.500 10.650 10.650
(0.125)
Gy
32-bit ARM Cortex-M0 microcontroller
Hx
D1
LPC1111/12/13/14
Hy
By
© NXP B.V. 2011. All rights reserved.
Ay
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