CBTD3306GM NXP [NXP Semiconductors], CBTD3306GM Datasheet - Page 12

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CBTD3306GM

Manufacturer Part Number
CBTD3306GM
Description
Dual bus switch with level shifting Multiple package options
Manufacturer
NXP [NXP Semiconductors]
Datasheet
NXP Semiconductors
Fig 16. Package outline SOT833-1 (XSON8)
CBTD3306
Product Specification
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
UNIT
mm
SOT833-1
VERSION
OUTLINE
max
A
terminal 1
index area
0.5
e
(1)
(2)
max
0.04
L
A
1
1
0.25
0.17
b
IEC
- - -
1
8
2.0
1.9
D
e
1
1.05
0.95
E
0
2
7
MO-252
JEDEC
0.6
All information provided in this document is subject to legal disclaimers.
e
e
D
REFERENCES
1
0.5
e
1
Rev. 5 — 28 April 2011
3
6
0.35
0.27
L
JEITA
e
- - -
1
0.40
0.32
scale
L
1
1
b
4
5
A
L
1
E
A
Dual bus switch with level shifting
(2)
2 mm
PROJECTION
EUROPEAN
CBTD3306
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
07-11-14
07-12-07
SOT833-1
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