CBTD3306GM NXP [NXP Semiconductors], CBTD3306GM Datasheet

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CBTD3306GM

Manufacturer Part Number
CBTD3306GM
Description
Dual bus switch with level shifting Multiple package options
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1. General description
2. Features and benefits
3. Ordering information
Table 1.
4. Marking
Table 2.
Type number
CBTD3306D
CBTD3306PW
CBTD3306GT
CBTD3306GM
Type number
CBTD3306D
CBTD3306PW
CBTD3306GT
CBTD3306GM
Ordering information
Marking codes
Package
Name
SO8
TSSOP8
XSON8
XQFN8U
The CBTD3306 dual FET bus switch features independent line switches. Each switch is
disabled when the associated output enable (nOE) input is HIGH.
The CBTD3306 is characterized for operation from −40 °C to +85 °C.
CBTD3306
Dual bus switch with level shifting
Rev. 5 — 28 April 2011
Designed to be used in 5 V to 3.3 V level shifting applications with internal diode
5 Ω switch connection between two ports
TTL-compatible input levels
Multiple package options
Latch-up protection exceeds 100 mA per JESD78B
ESD protection:
HBM JESD22-A114F exceeds 2000 V
CDM JESD22-C101E exceeds 1000 V
Description
plastic small outline package; 8 leads; body width 3.9 mm
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
plastic extremely thin small outline package; no leads; 8 terminals;
body 1 × 1.95 × 0.5 mm
plastic extremely thin quad flat package; no leads; 8 terminals;
body 1.6 × 1.6 × 0.5 mm
Marking code
CBTD3306
D306
W06
W06
Product data sheet
Version
SOT96-1
SOT530-1
SOT833-1
SOT902-1

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CBTD3306GM Summary of contents

Page 1

... Marking Table 2. Marking codes Type number CBTD3306D CBTD3306PW CBTD3306GT CBTD3306GM Description plastic small outline package; 8 leads; body width 3.9 mm plastic thin shrink small outline package; 8 leads; body width 4.4 mm plastic extremely thin small outline package; no leads; 8 terminals; body 1 × 1.95 × 0.5 mm plastic extremely thin quad flat package; no leads; 8 terminals; ...

Page 2

NXP Semiconductors 5. Functional diagram Fig 1. Logic diagram 6. Pinning information 6.1 Pinning CBTD3306 1OE GND 4 001aak832 Fig 2. Pin configuration for SO8 (SOT96-1) CBTD3306 1OE GND 4 ...

Page 3

NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin 1OE, 2OE GND Functional description [1] Table 4. Function selection Input nOE L H ...

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NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter V input clamping voltage IK I input leakage current I I supply current CC V pass voltage pass ΔI additional ...

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NXP Semiconductors 10.1 Typical pass voltage graphs 3.6 V pass (V) (1) 3.2 (2) (3) 2.8 (4) 2.4 2.0 4.4 4.8 = 100 μ ( (4) I ...

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NXP Semiconductors = 100 μ ( Fig 10. Pass voltage versus supply voltage; T CBTD3306 Product Specification 3.6 V pass (V) ...

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NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t propagation delay pd t enable time en t disable time dis [1] The propagation delay ...

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NXP Semiconductors nOE input output LOW to OFF OFF to LOW output HIGH to OFF OFF to HIGH Measurement points are given in Logic levels: V and Fig 12. Enable and disable times Table 9. Measurement points ...

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NXP Semiconductors 13. Test information Test data is given in Table All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Z The outputs are measured one at a time with one transition per measurement. ...

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NXP Semiconductors 14. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

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NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 ...

Page 12

NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A ...

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NXP Semiconductors XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 ...

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NXP Semiconductors 15. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge FET Field Effect Transistor HBM Human Body Model PRR Pulse Rate Repetition TTL Transistor-Transistor Logic 16. Revision history Table 12. Revision history Document ID ...

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NXP Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18. Contact information For more information, please visit: For sales ...

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NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...

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