CBTD3306GM NXP [NXP Semiconductors], CBTD3306GM Datasheet - Page 11

• Manufacturer Part Number: CBTD3306GM
• Description: Dual bus switch with level shifting Multiple package options
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
Fig 15. Package outline SOT530-1 (TSSOP8)
CBTD3306
Product Specification
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT530-1
max.
1.1
A
0.15
0.05
A 1
1
0.95
0.85
8
A 2
y
IEC
e
pin 1 index
Z
0.25
A 3
D
0.30
0.19
b p
b p
5
4
All information provided in this document is subject to legal disclaimers.
MO-153
0
0.20
0.13
JEDEC
c
w
M
REFERENCES
D
3.1
2.9
(1)
Rev. 5 — 28 April 2011
c
E
4.5
4.3
(2)
JEITA
scale
A 2
2.5
0.65
e
A 1
H E
6.5
6.3
0.94
L
H E
E
detail X
0.7
0.5
L p
5 mm
Dual bus switch with level shifting
L
0.1
v
L p
PROJECTION
EUROPEAN
0.1
w
(A 3 )
A
0.1
y
θ
CBTD3306
A
0.70
0.35
X
Z
© NXP B.V. 2011. All rights reserved.
(1)
v
ISSUE DATE
M
00-02-24
03-02-18
A
8°
0°
θ
SOT530-1
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