USB3300_06 SMSC [SMSC Corporation], USB3300_06 Datasheet - Page 49

• Manufacturer Part Number: USB3300_06
• Description: Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface
• Manufacturer: SMSC [SMSC Corporation]

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface
Datasheet
Chapter 8 Package Outline
SMSC USB3300
ccc
A1
A2
A3
D2
E1
E2
D1
D
A
E
L
e
b
Figure 8.1 USB3300-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free)
The USB3300 is offered in a compact 32 pin lead-free QFN package.
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
4. Coplanarity zone applies to exposed pad and terminals.
terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material
conditions (MMC).
0.70
4.85
4.55
3.15
4.85
4.55
3.15
0.30
0.18
MIN
0
~
~
Table 8.1 32 Terminal QFN Package Parameters
NOMINAL
0.20 REF
0.50 BSC
0.02
0.25
5.0
3.3
5.0
3.3
~
~
~
~
~
~
DATASHEET
MAX
1.00
0.05
0.90
5.15
4.95
3.45
5.15
4.95
3.45
0.50
0.30
0.08
49
Copper Lead-frame Substrate
Overall Package Height
X exposed Pad Size
Y exposed Pad Size
X Mold Cap Size
Y Mold Cap Size
Terminal Length
Mold Thickness
Terminal Width
X Overall Size
Y Overall Size
Terminal Pitch
REMARKS
Coplanarity
Standoff
Revision 1.06 (07-19-06)