MPC8264 MOTOROLA [Motorola, Inc], MPC8264 Datasheet - Page 44

• Manufacturer Part Number: MPC8264
• Description: MPC826xA (HiP4) Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

1.5.2
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
44
Mechanical Dimensions
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
MPC826xA (HiP4) Family Hardware Specifications
Notes:
1. Dimensions and Tolerancing per
2. Dimensions in millimeters.
3. Dimension b is measured at the
4. Primary data A and the seating
ASME Y14.5M-1994.
maximum solder ball diameter,
parallel to primary data A.
plane are defined by the spherical
crowns of the solder balls.
Dim
A1
A2
A3
D1
E1
A
D
E
b
e
1.45
0.60
0.85
0.25
0.65
Min
Millimeters
37.50 BSC
37.50 BSC
35.56 REF
35.56 REF
1.27 BSC
MOTOROLA
Max
1.65
0.70
0.95
0.85
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