MPC8264 MOTOROLA [Motorola, Inc], MPC8264 Datasheet - Page 43

• Manufacturer Part Number: MPC8264
• Description: MPC826xA (HiP4) Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

1.5
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
1.5.1
Package parameters are provided in Table 21. The package type is a 37.5 x 37.5 mm, 480-lead TBGA.
MOTOROLA
Package Description
Package Parameters
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
MPC826xA (HiP4) Family Hardware Specifications
Parameter
Table 21. Package Parameters
37.5 x 37.5 mm
480 (29 x 29 ball array)
1.27 mm
Value
Package Description
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