MPC8264 MOTOROLA [Motorola, Inc], MPC8264 Datasheet - Page 30

• Manufacturer Part Number: MPC8264
• Description: MPC826xA (HiP4) Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
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Figure 13. Pinout of the 480 TBGA Package as Viewed from the Top Surface
Soldermask
1.27 mm Pitch
Polymide Tape
MPC826xA (HiP4) Family Hardware Specifications
(Oxidized for Insulation)
Copper Heat Spreader
Figure 14. Side View of the TBGA Package
Glob-Top Dam
Glob-Top Filled Area
View
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Copper Traces
Cavity
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Pressure Sensitive
Adhesive
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