PCF8523 NXP [NXP Semiconductors], PCF8523 Datasheet - Page 57

• Manufacturer Part Number: PCF8523
• Description: Real-Time Clock (RTC) and calendar
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
17. Packing information
PCF8523
Product data sheet
Fig 41. PCF8523U wafer information
Fig 42. Film Frame Carrier (FFC) (for PCF8523U)
1.449 mm
(1) Die marking code.
Seal ring plus gap to active circuit ~18 m. Wafer thickness 200 m.
PCF8523U: bad die are marked in wafer mapping.
276 mm
1
1
∅ 250 mm
1.492 mm
plastic frame
X
straight edge
of the wafer
(1)
All information provided in this document is subject to legal disclaimers.
1
1
plastic film
60.2 mm
Rev. 3 — 30 March 2011
276 mm
straight edge
63.5 mm
of the wafer
45 μm
Real-Time Clock (RTC) and calendar
0.3
Saw lane
detail X
~18 μm
70 μm
013aaa351
2.6 mm
PCF8523
© NXP B.V. 2011. All rights reserved.
013aaa232
~18 μm
57 of 66